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Liquid Phase Electron-Beam-Induced Deposition on Bulk Substrates Using Environmental Scanning Electron Microscopy

Published online by Cambridge University Press:  03 March 2014

Matthew Bresin ,
Aurelien Botman ,
Steven J Randolph ,
Marcus Straw  and
Jeffrey Todd Hastings
Matthew Bresin
Affiliation:
Department of Electrical and Computer Engineering, University of Kentucky, 453 F. Paul Anderson Tower, Lexington, KY 40506, USA
Aurelien Botman
Affiliation:
FEI Company, 5350 Dawson Creek Drive, Hillsboro, OR 97214, USA
Steven J Randolph
Affiliation:
FEI Company, 5350 Dawson Creek Drive, Hillsboro, OR 97214, USA
Marcus Straw
Affiliation:
FEI Company, 5350 Dawson Creek Drive, Hillsboro, OR 97214, USA
Jeffrey Todd Hastings*
Affiliation:
Department of Electrical and Computer Engineering, University of Kentucky, 453 F. Paul Anderson Tower, Lexington, KY 40506, USA
*
*Corresponding author.[email protected]
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Abstract

The introduction of gases, such as water vapor, into an environmental scanning electron microscope is common practice to assist in the imaging of insulating or biological materials. However, this capability may also be exploited to introduce, or form, liquid phase precursors for electron-beam-induced deposition. In this work, the authors report the deposition of silver (Ag) and copper (Cu) structures using two different cell-less in situ deposition methods—the first involving the in situ hydration of solid precursors and the second involving the insertion of liquid droplets using a capillary style liquid injection system. Critically, the inclusion of surfactants is shown to drastically improve pattern replication without diminishing the purity of the metal deposits. Surfactants are estimated to reduce the droplet contact angle to below ~10°.

Keywords

electron-beam-induced depositionliquid phaseliquid injection systemcontact anglenanolithography
Type
In Situ Special Section
Information
Microscopy and Microanalysis , Volume 20 , Issue 2 , April 2014 , pp. 376 - 384
Copyright
© Microscopy Society of America 2014 

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