No CrossRef data available.
Article contents
High throughput Imaging and Increasing Resolution of X-ray Imaging at High Acceleration Voltages
Published online by Cambridge University Press: 22 July 2022
Abstract
An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
- Type
- Advanced 3D Imaging and Analysis Methods for New Opportunities in Material Science
- Information
- Copyright
- Copyright © Microscopy Society of America 2022
References
Lapedus, M., Can We Measure Next-Gen FinFETs? Semiconductor engineering, Nov 21 2016Google Scholar
Kline, R. J., Sunday, D. F., Windover, D. and Wu, W., ‘Bringing CD-SAXS to the Fab’, SEMICON West 2014, 2014.Google Scholar
Bowen, D. and Tanner, B., X-ray metrology in semiconductor manufacturing. Boca Raton: CRC/Taylor & Francis, 2006.Google Scholar
Thompson, W. D., Joseph Kline, R., and Sorkhabi, Osman, Characterization of a Lab Based CD-SAXS Tool, Frontiers of characterization and metrology for nanoelectronics (FCMN) Monterey, 2017.Google Scholar
Bowen, D. and Tanner, B., X-ray metrology in semiconductor manufacturing. Boca Raton: CRC/Taylor & Francis, 2006.Google Scholar
Schulze, A., X-Ray Metrology for The Semiconductor Industry, Int. Workshop on Compact EUV and X-ray Light Sources 2015.Google Scholar
Beetz, T., 'High-resolution X-ray Tomography Imaging Systems', CHESS Users’ Meeting Ithaca, NY, 2008.Google Scholar
Gullikson, E., Filter transmission, http://henke.lbl.gov/optical_constants/filter2.html, visited on 2015-03-24.Google Scholar
Rudati, J. - Rapid integrated circuit inspection for reliability and security inspection, International Conference X-ray Microscopy XRM, Oxford, 2016.Google Scholar
Patt, M., HAXPES-Lab: The first laboratory based hard X-ray photoelectron spectroscopy system using a 9.25 keV X-ray source, ECOSS, Grenoble, 2016.Google Scholar
You have
Access