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Electron tomography of inlaid copper interconnect structures

Published online by Cambridge University Press:  05 September 2003

Heiko Stegmann ,
Hans-Jürgen Engelmann  and
Ehrenfried Zschech
Heiko Stegmann
Affiliation:
AMD Saxony LLC & Co. KG, Wilschdorfer Landstrasse 101, 01109 Dresden, Germany
Hans-Jürgen Engelmann
Affiliation:
AMD Saxony LLC & Co. KG, Wilschdorfer Landstrasse 101, 01109 Dresden, Germany
Ehrenfried Zschech
Affiliation:
AMD Saxony LLC & Co. KG, Wilschdorfer Landstrasse 101, 01109 Dresden, Germany
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Type
Invited Papers
Information
Microscopy and Microanalysis , Volume 9 , Issue S03 , September 2003 , pp. 270 - 271
Copyright
Copyright © Microscopy Society of America 2003

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