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On-Line Process Control Compositional Analysis of Aluminum Films Containing a Low Percentage of Copper

Published online by Cambridge University Press:  06 March 2019

G. H. Glade ,
J. M. Matthews  and
F. R. Titcomb
G. H. Glade
Affiliation:
IBM Components Division Essex Junction, Vermont 05452
J. M. Matthews
Affiliation:
IBM Components Division Essex Junction, Vermont 05452
F. R. Titcomb
Affiliation:
IBM Components Division Essex Junction, Vermont 05452
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Abstract

Aluminum film conducting stripes are widely used for semiconductor device interconnection networks. The addition of a low percentage of copper significantly increases their life. Composition must be controlled to maintain product quality.

The paper discusses various methods used to analyze the copper composition in the aluminum films, and adaptation of one of these methods for process control application. A portable instrument designed for field use was adapted for use as an on-line instrument.

Type
Research Article
Information
Advances in X-Ray Analysis , Volume 15: Twentieth Annual Conference on Applications of X-ray Analysis, August 11-13, 1971 , 1971 , pp. 539 - 547
Copyright
Copyright © International Centre for Diffraction Data 1971

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References

1. Ames, I., d'Heurle, F. M. and Horstman, R. E., “Reduction of Electromigration in Aluminum Films by Copper Doping,” IBM J. Res, and Develop., July 1970, pp. 461–463.Google Scholar
2. Liebhafsky, H. A., Pfeiffer, H. G., Winslow, E. H. and Zemany, P. D., X-Ray Absorption and Emission in Analytical Chemistry, p. 313, John Wiley and Sons (1960).Google Scholar