Physical and/or chemical changes such as refinement, component dissolution, exchange/adsorption, structural evolution and recombination of phyllosilicate minerals occur continuously in a naturally weakly acidic water environment. To compare the differential dissolution of cations that occupy various sites in vermiculite, trioctahedral vermiculite was dissolved in various concentrations of oxalate for 24 h and in 0.2 M oxalate for various durations. The concentration of ions in the leaching solution and the phase, structure and morphology of the original samples and acid-leached samples were analysed. Structural analysis showed that the 001 reflections of vermiculite gradually shifted to a higher angle and eventually disappeared after the dissolution of interlayer cations caused by acid leaching. The amount and rate of dissolution of each cation in the vermiculite showed that the octahedral cation Mg2+ is more soluble than Fe2+ and Fe3+. The dissolution rates of Al3+, Mg2+ and Ca2+ were greatest in the first 4 h and then decreased gradually. Amorphous silicon dioxide and calcium oxalate were formed during acid leaching, and calcium oxalate was formed in the first 4 h. After leaching with oxalate for various periods, the cation-exchange capacity (CEC) of the samples first increased and then decreased. Micromorphology analysis showed that the acid erosion process started from the edges. The results of this work contribute to our understanding of many natural geochemical processes, and they will be useful for several applications such as soil improvement, ecological restoration and environmental protection.

The interfacial reactions in Cu/Sn–52In/Cu interconnects during solid–solid (S–S) and liquid–solid (L–S) electromigration (EM) under a current density of 2.0 × 104 A/cm2 at 90 and 150 °C have been in situ studied using synchrotron radiation real-time imaging technology. The In atoms directionally migrate toward the cathode due to the back-stress induced by the preferential migration of the Sn atoms over the In atoms toward the anode during the S–S EM, resulting in the segregation of the Sn and In atoms at the anode and cathode, respectively. During the L–S EM, however, the In atoms directionally migrate toward the anode due to the negative effective charge number (Z*) of In rather than the back-stress. The polarity effect, i.e., the intermetallic compounds growing continuously at the anode while becoming thinner at the cathode, is more significant during the L–S EM than the S–S EM. Furthermore, the consumption rate of the cathode Cu during the L–S EM is three orders of magnitude higher than that in the case of the S–S EM because of the significantly higher EM-induced atomic flux in the liquid solder. The migrations of the Sn, In, and Cu atoms are discussed in terms of diffusion flux.

Interfacial reactions at 100 and 150 °C in the Sn–20.48 at.% In–3.05 at.% Ag (Sn–20.0 wt% In–2.8 wt% Ag)/Ni couples are studied. Three unusual phenomena are observed. First, liquation is found in Sn–20.48 at.% In–3.05 at.% Ag (Sn–In–Ag)/Ni couples that are reacted at 150 °C, which is lower than the melting points of both the solder and the Ni substrate. In addition to the Ni3Sn4 phase, liquid phase is formed in the reaction layer. Second, the liquid phase disappears and isothermal solidification occurs when there is prolonged isothermal heat treatment at 150 °C. The results are similar to those for transient liquid phase bonding. Third, the thickness of the reaction layer in Sn–In–Ag/Ni couples that are reacted for 1440 h at 150 °C is 40 times thicker than that of those reacted at 100 °C. The reaction mechanisms for these three unusual phenomena: liquation, isothermal solidification, and an extraordinary increase in the reaction rate for only 50 °C difference in temperature are elaborated and are related to each other.