The interconnectedness of Atlantic West Africa and the Scandinavian Atlantic in the seventeenth and eighteenth centuries exemplifies an entangled or shared history (histoire croisée). The present article maintains that in the context of the brutal transatlantic chattel trade this history manifests different historical trajectories as well as the temporality of episodic events and structural duration that are configured in the divergent itineraries of two eighteenth-century African Christians. Their texts and life histories reveal them as purveyors of intertwined Christian and non-Christian cultural codes and discursive fields, in one case according to a plantation-colony itinerary and in the other according to a world-port itinerary. The complex social realities of multiple texts and material cultures did not operate independently of socioeconomic structures intertwined with Atlantic world circuits.

This paper proposes a model of network interactions in the interbank market. Our innovation is to model systemic risk in the interbank network as the propagation of incentives or strategic behavior rather than the propagation of losses after default. Transmission in our model is not based on default. Instead, we explain bank profitability based on competition incentives and the outcome of a strategic game. As competitors' lending decisions change, banks adjust their own decisions as a result: generating a “transmission” of shocks through the system. We provide a unique equilibrium characterization of a static model, and embed this model into a full dynamic model of network formation. We also determine the key bank, which is the bank that is crucial for the stability of the financial network.

The drive toward higher density and higher performance in integrated circuits creates a need to keep interconnects short and eliminate layers of packaging. In this article, we propose a novel, ultrahigh-density (exceeding 104 leads per cm2), compliant, wafer-level, input/output interconnection technology called “sea of leads” as a key enabling technology for future high-performance microsystems. The mechanical compliance is addressed through slippery leads (leads released from the surface) and embedded air gaps. The ability to fabricate embedded air gaps has enabled the integration of optical interconnects with high index-of-refraction mismatches between the core and cladding.