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X-Ray Residual Stress Measurement in Films with Crystallographic Texture and Grain Shape

Published online by Cambridge University Press:  15 February 2011

L. G. Yu ,
B. C. Hendrix ,
K. W. Xu ,
J. W. He  and
H. C. Gu
L. G. Yu
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
B. C. Hendrix
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
K. W. Xu
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
J. W. He
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
H. C. Gu
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong Univ., Xi'an, 710049, China
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Abstract

X-ray diffraction provides an easy and powerful method for measuring residual stress in thin films. However, nonlinearity of the d vs. sin2ψ relation can lead to the misinterpretation of results, especially when one of the measurements is made at low values of ψ relation for different combinations of ideal crystallographic textures and grain shapes are given. In all cases, a high ψ angle range exists where the d vs. sin2ψ relation in the low ψ angle range.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 403: Symposium I – Polycrystalline Thin Films: Structure, Texture, Properties and Applications II , 1995 , 177
Copyright
Copyright © Materials Research Society 1996

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