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A Unified Approach to Grain Boundary Diffusion and Nucleation in Thin Film Reactions

Published online by Cambridge University Press:  15 February 2011

K. R. Coffey
Affiliation:
IBM, Storage Systems Division, 5600 Cottle Road, San Jose, CA £5193
K. Barmak
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015
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Abstract

An alternative model is proposed to extend the conventional view of diffusion under a concentration gradient in a grain boundary phase of width δ. The conventional model is well developed and readily applied to the thickening kinetics of polycrystalline product phases in binary diffusion couples, however it is not readily extended to other phenomena of interest in thin films, i.e., the nucleation and growth of the product phase crystallites prior to formation of a product phase layer. In the alternative model presented here, non-equilibrium thermodynamics is used to define the chemical potentials, μi, for each atomic specie in the grain and interphase boundaries of a polycrystalline diffusion couple. The chemical potential difference for each specie between the bulk phases of the diffusion couple is partitioned between the driving force for grain boundary diffusion and that for interfacial reaction. This partition leads to a characteristic decay length that describes the spatial variation of μi. Numerical calculations of μi are used to show that boundary diffusion favors heterogeneous nucleation. Product nucleation in thin film reactions is seen to be similar to precipitation from a bulk solid solution.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

1. Thomas, O., Peterson, C.S., and d’Heurle, F.M., Appl. Surf. Sci. 53, 138 (1991).Google Scholar
2. d’Heurle, F.M., Mater, J.. Res. 3, 167 (1988).Google Scholar
3. Coffey, K.R., Barmak, K., Rudman, D.A., S., Foner, J. Appl. Phys. 72, 1341 (1992).CrossRefGoogle Scholar
4. K.R., Coffey, Barmak, K., Rudman, D.A., Foner, S., Mater. Res. Soc. Proc. 230, 55 (1992).Google Scholar
5. Barmak, K., Coffey, K.R., Rudman, D.A., Foner, S., Mater. Res. Soc. Proc. 230, 61 (1992).CrossRefGoogle Scholar
6. Balluffi, R.W., and Blakely, J.M., Thin Solid Films 25, 363 (1975).Google Scholar
7. Harrison, L.G., Trans. Faraday Soc. 57, 1191 (1961).Google Scholar
8. Gupta, D., Campbell, D.R., and Ho, P.S., in Thin Films – Interdiffusion and Reactions, eds. Poate, J.M., Tu, K.N., and Mayer, J.W., Wiley Publishers, New York, 161 (1978).Google Scholar
9. Hwang, J.C.M. and Balluffi, R.W., J. Appl. Phys. 50, 1339 (1979).Google Scholar
10. Callen, H.B., Thermodynamics and Thermostatistics. John Wiley & Sons, 307 (1985).Google Scholar
11. Langer, J.S. and Sekerka, R.F., Acta. Met. 23, 1225 (1975).Google Scholar
12. Gösele, U. and Tu, K.N., J. Appl. Phys. 53, 3252 (1982).Google Scholar
13. Bené, R.W., J. Appl. Phys. 61, 1826 (1987).Google Scholar
14. Muria, H., Ma, E., and Thompson, C.V., J. Appl. Phys, 70, 4287 (1991).Google Scholar
15. Coffey, K.R. and Barmak, K., Acta Met. et Mater., accepted for publication.Google Scholar
16. Barmak, K. and Coffey, K.R., Mater. Res. Soc. Proc. 311, 51 (1993).Google Scholar
17. Sigsbee, R.A., Pound, G.M., Advan. Col. Interf. Sci. 1, 335 (1967).Google Scholar
18. Barmak, K., Coffey, K.R., Rudman, D.A., Foner, S., J. Appl. Phys. 67, 7313 (1990).CrossRefGoogle Scholar