Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-25T17:42:10.311Z Has data issue: false hasContentIssue false
  • English
  • Français

Temperature Dependence of Thermal Conductivity of Electronic Ceramics by an Improved Flash Diffusivity Technique

Published online by Cambridge University Press:  21 February 2011

R. C. Enck  and
R. D. Harris
R. C. Enck
Affiliation:
BP Research, Warrensville Research Center 4440 Warrensville Center Rd., Cleveland, OH 44128, USA
R. D. Harris
Affiliation:
BP Research, Warrensville Research Center 4440 Warrensville Center Rd., Cleveland, OH 44128, USA
Get access

Abstract

The thermal conductivity of ceramic materials used for IC substrates and packages has increased in importance as chip sizes have decreased and heat loads have risen. AIN which has a room temperature (RT) thermal conductivity (λ) greater than 200 W/m·K and BeO with λ(RT) ∼260 W/m·K are the major candidates for applications demanding high conductivity. Conflicting reports of the temperature dependences of λ for these materials over the range of interest for packaging use (≤200°C) have been published, with some reports suggesting a crossover in λ. These reported differences may be due to the reported problems in measuring λ in AIN using the flash diffusivity method. For the present experiments, we have used a new long wavelength laser flash diffusivity system which has been shown to determine thermal diffusivity to better than ± 3% for AIN with sample thicknesses ranging from 0.3 mm to 5 mm. No absorbinq coatings are required and no correction factors are needed to fit the data to theory. We report λ from room temperature to 400°C for AIN from a number of commercial sources, and for BeO and SiC. At room temperature, BeO has the highest thermal conductivity, but as the temperature is raised, the values for BeO and AIN approach one another, with crossover observed at about 350°C for the highest conductivity AIN sample studied. Recent steady state heat flow measurements agree with our thermal conductivity values rather than with previous literature values.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 235
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Parker, W.J., Jenkins, R.J., Butler, C.P. and Abbott, G.L., J. Appl. Phys., 32(9) 1679–84 (1961).Google Scholar
2. Taylor, R.E. and Maglic, K.D., Compendium of Thermophysical Property Measurement Methods 1, Edited by Maglic, K.D., Cezairiyan, A., and Peletsky, V.E., Plenum Press, New York (1984).Google Scholar
3. Technical Bulletin, Tokuyama Soda Co. Ltd., Tokyo, Japan, Feb(1987).Google Scholar
4. Nobuyuki Kuramoto, Hitofumi Taniguchi, and Isao Asa, presented at International Symposium on Ceramic Substrates and Packages, Oct. 19–21 (1987), Denver.Google Scholar
5. Hastert, J.L., presented at International Symposium on Ceramic Substrates and Packages, Oct. 19–21 (1987), Denver.Google Scholar
6. Knudsen, A.K., Langhoff, C.A., and Delzer, S.H., presented at Annual Meeting of American Ceramic Society, April 26–30 (1987) Pittsburgh, PA.Google Scholar
7. Dinwiddie, R.B., Whittaker, A.J., and Onn, D.G., Int. J. Thermophysics 10 (5), 1075 (1989).Google Scholar
8. Hasselman, D.P.H. and Merkel, G.A., J. Am. Ceram. Soc. 72 (6), 967 (1989).Google Scholar
9. Dettmer, E., Romenesko, B., Carkhuff, B., Charles, H.K., and Enck, R.C., presented at the 1989 ISHM Advanced Materials Conf., Oriando, FL, 1989 (unpublished).Google Scholar
10. Dettmer, E.S., Romenesko, B.M., Charles, H.K. Jr., Carkhuff, B.G., and Merrill, D.J., presented at the 1989 IEEE Electronics Components Conf., Houston, TX, 1989.Google Scholar
11. Enck, R.C., Harris, R.D., and Youngman, R.A., Advanced Characterization Techniques for Ceramics, edited by Young, W. (Ceramics Transactions, Vol.5, American Ceramic Soc., Westerville, OH, 1989) pp. 214–222.Google Scholar
12. Kuramoto, N., Tanguchi, H., and Aso, I., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, C.HMT–9, (4), pp. 386–390, (1986).Google Scholar
13. Kurokawa, Y., Utsumi, K., Takamizawa, H., Kamata, T., and Noguchi, S., Proceedings of the First CHMT Symposium, Tokyo, Japan (1984) pp. 15–22.Google Scholar
14. Callaway, J., Phys. Rev. 113, 1046 (1959).Google Scholar
15. Kingery, W.D., Bowen, H.K., Uhlmann, D.R., Introduction to Ceramics 2nd ed (John Wiley & Sons, New York, 1976), p. 615–618.Google Scholar