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Stress and Density of Thin TiO2 Films Produced by Different Methods

Published online by Cambridge University Press:  21 February 2011

C. R. Ottermann ,
M. Heming  and
K. Bange
C. R. Ottermann
Affiliation:
SCHOTT GLASWERKE, R&D, P.O. Box 24 80, 55014 Mainz, Germany
M. Heming
Affiliation:
SCHOTT GLASWERKE, R&D, P.O. Box 24 80, 55014 Mainz, Germany
K. Bange
Affiliation:
SCHOTT GLASWERKE, R&D, P.O. Box 24 80, 55014 Mainz, Germany
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Abstract

Stress, density and refractive behavior are analyzed for TiO2 layers deposited by reactive evaporation (RE), ion plating (IP), plasma impulse chemical vapour deposition (PICVD) and spin coating (SP) from bending of the substrate and by means of Rutherford Backscattering Spectroscopy (RBS), respectively. Densities between 2.7 gem-3 and 3.8 gem-3 are obtained depending on coating techniques and coating conditions. Refractive index depends linear on density. A correlation between film stress and density is observed which is independent from coating process, production parameters and crystal structure of the as-deposited films. Stress is tensile at low densities and compressive for films with densities of the order of the crystal phase of anatase (3.84 gem-3). The phase transition from amorphous to anatase due to annealing induces an increase in stress. Film density determines the transition temperature, and the magnitude of stress increase.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 187
Copyright
Copyright © Materials Research Society 1995

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References

[1] Bange, K. et al., BMFT-Abschlußbericht FKZ 13 N 5476 6 (1991)Google Scholar
[2] Otto, J. et al., Proc. SPIE 1323, 39 (1990)Google Scholar
[3] Schröder, H., Phys. Thin Films 5, 87 (1969)Google Scholar
[4] Ottermann, C. R. and Bange, K., (in preparation)Google Scholar
[5] Ottermann, C. R., Otto, J., Jeschkowski, U., Anderson, O., Heming, M. and Bange, K., in Thin Films: Stress and Mechanical Properties IV, edited by Townsend, P.H., Weihs, T P., Sanchez, J.E. Jr. and Borgesen, P. (Mat. Res. Soc. Proc. 308, Pittsburgh, PA, 1993), pp 69–75 Google Scholar
[6] Ottermann, C. R., Temmink, A. and Bange, K., Proc. SPIE 1272, 111 (1990)Google Scholar
[7] Hüppauff, M., Bange, K., Lengler, B., Thin Solid Films 230, 191 (1993)Google Scholar
[8] Ottermann, C. R., Bange, K., Wagner, W., Laube, M. and Rauch, F., Surf. Interface Anal. 19, 435 (1992)Google Scholar
[9] Wagner, W., Rauch, F. and Bange, K., Fresenius Z. Anal. Chem. 333, 478 (1989)Google Scholar
[10] Laube, M., Wagner, W., Rauch, F., Ottermann, C., Bange, K. and Niederwald, H., Glastechn. Ber. Glass Sci. Techn. 67, 87 (1994)Google Scholar
[11] Windischmann, H., J. Vac. Sci. Techn. A9, 2431 (1991)Google Scholar
[12] Thielsch, R., Meiling, W. and Göring, E., Vacuum 41, 1147 (1990)Google Scholar