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Strain and Texture in Al-Interconnect Wires Weasured by X-Xay Microbeam Diffraction

Published online by Cambridge University Press:  10 February 2011

Nobumichi Tamura ,
J.-S. Chung ,
G. E. Ice ,
B. C. Larson ,
J. D. Budai ,
J. Z. Tischler  and
M. Yoon
Nobumichi Tamura
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN, E.L. Williams, W.P. Lowe, Howard University, Washington D.C.
J.-S. Chung
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN, E.L. Williams, W.P. Lowe, Howard University, Washington D.C.
G. E. Ice
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN, E.L. Williams, W.P. Lowe, Howard University, Washington D.C.
B. C. Larson
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN, E.L. Williams, W.P. Lowe, Howard University, Washington D.C.
J. D. Budai
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN, E.L. Williams, W.P. Lowe, Howard University, Washington D.C.
J. Z. Tischler
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN, E.L. Williams, W.P. Lowe, Howard University, Washington D.C.
M. Yoon
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN, E.L. Williams, W.P. Lowe, Howard University, Washington D.C.
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Abstract

The local strain and texture in Al interconnect wires have been investigated using white and monochromatic x-ray microbeams on the MHATTCAT undulator beam line at the Advanced Photon Source. Intergrain and intragrain orientations were obtained with ∼0.01° sensitivity using white beam measurements on wide Al pads (∼100 μm) and thin (2 μm) Al wires. Orientation changes of up to 1°were found within individual grains of the (111) textured Al interconnects. Deviatoric strain measurements indicate small intragranular strain variations, but intergranular strain variations were found to be quite large.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 563: Symposium M – Materials Reliability in Microelectronics IX , 1999 , 175
Copyright
Copyright © Materials Research Society 1999

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