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Patterning 2D Metallic Surfaces by Soft Lithography

Published online by Cambridge University Press:  15 March 2011

M. Toprak
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE-100 44 Stockholm, Sweden
D. K. Kim
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE-100 44 Stockholm, Sweden
M. Mikhailova
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE-100 44 Stockholm, Sweden
M. Muhammed
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE-100 44 Stockholm, Sweden
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Abstract

In this study, we report on the development of a μCP technique, where the ink used on the surface of the stamp is made of aminopropyl trimethoxy silane (APTMS). The stamps for the μCP are prepared by polymerizing polydimethylsiloxane (PDMS) on photolithographically defined masters. Si wafers were used as the substrate on which a self assembled layer of APTMS was formed at the contact regions of the stamp. The regions of contact were subsequently used for the deposition of gold coated magnetite nanoparticles, resulting in 2D patterned metallic surfaces. The colloidal particles were analyzed by TEM and XRD, and the printed substrates were characterized by AFM.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

1. Kumar, A., Whitesides, G. M., Langmuir 10, 1498(1994).Google Scholar
2. Xia, Y., Kim, E., Whitesides, G. M., J. Electrochem. Soc. 143, 1070(1996)Google Scholar
3. Xia, Y., Kim, E., Mrksich, M., Whitesides, G.M., Chem. Mater. 8, 601(1996).Google Scholar
4. John, P. M. St., Craighead, H. G., Appl. Phys. Lett. 68, 1022(1996).Google Scholar
5. Freeman, R. G., Grabar, K. C., Allison, K. J., et al. Science 267, 1629(1995).Google Scholar
6. Chumanov, G., Sokolov, K., Gregory, B. W., Cotton, T. M., J. Phys. Chem. 99, 9466(1995).Google Scholar
7. Liu, J. F., Zhang, L-G, Gu, N., Ren, J. Y., Wu, Y. P., Lu, Z. H., Mao, P. S., Chen, D. Y., Thin Solid Films 327–329, 176(1998).Google Scholar
8. Potochnik, S. J., Pehrsson, P. E., Hsu, D. S. Y., Calvert, J. M., Langmuir 11, 1841(1995).Google Scholar
9. Hidber, P. C., Helbig, W., Kim, E., Whitesides, G. M., Langmuir 12, 1375(1996).Google Scholar
10. Schedin, F., Morrall, P., Petrov, V. N., Case, S., Thomas, M. F., Dudzik, E., Laan, G. van der, Thornton, G., J. Magn. Magn. Mater. 211, 266(2000).Google Scholar
11. Libioulle, L., Bietsch, A., Schmid, H., Michel, B., Delamarche, E., Langmuir 15, 300(1999).Google Scholar
12. Kim, D. K., Mikhaylova, M., Toprak, M., Muhammed, M., presented at MRS 2001 Fall Meeting, Boston, Massachusetts November 26-30, 2001.Google Scholar