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A New Synchrotron-based Technique for Measuring Stresses in Ultrathin Metallic Films

Published online by Cambridge University Press:  15 March 2011

Jochen Böhm
Affiliation:
Institut für Metallkunde, Universität Stuttgart, Heisenbergstr. 3, D-70569 Stuttgart, Germany
Patric Gruber
Affiliation:
Institut für Metallkunde, Universität Stuttgart, Heisenbergstr. 3, D-70569 Stuttgart, Germany
Ralph Spolenak
Affiliation:
Max Planck Institute for Metals Research, Heisenbergstr. 3, D-70569 Stuttgart, Germany
Alexander Wanner
Affiliation:
Institut für Werkstoffkunde I, Universität Karlsruhe (TH), D-76128 Karlsruhe, Germany
Eduard Arzt
Affiliation:
Institut für Metallkunde, Universität Stuttgart, Heisenbergstr. 3, D-70569 Stuttgart, Germany Max Planck Institute for Metals Research, Heisenbergstr. 3, D-70569 Stuttgart, Germany
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Abstract

A novel synchrotron-based X-ray diffraction technique is presented by which it is possible to characterize the evolution of stresses in polycrystalline metallic films thinner than 100 nm. The film under investigation is deposited on a flexible polyimide substrate which is subjected to a uniaxial tensile test. The evolutions of longitudinal and transverse elastic strains in the film are monitored simultaneously by means of a high-resolution area detector. The strain resolution is better than 10−4. The samples are typically subjected to 6 % total strain and subsequently unloaded. First experiments carried out on Au films in the thickness range between 20 nm and 1000 nm show the usefulness and the power of this new technique.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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