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A New Polyimide for Multi-Chip Modules Applications

Published online by Cambridge University Press:  21 February 2011

Hidetaka Satou ,
Daisuke Makino ,
Toru Kikuchi  and
Takayuki Saito
Hidetaka Satou
Affiliation:
Hitachi Chemical Co., Ltd.Yamazaki Works 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
Daisuke Makino
Affiliation:
Hitachi Chemical Co., Ltd.Yamazaki Works 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
Toru Kikuchi
Affiliation:
Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
Takayuki Saito
Affiliation:
Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory 4-13-1 Higashi-Cho, Hitachi-shi, Ibaraki, 317 Japan
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Abstract

Currently polyimides are used for a multitude of applications in the electronics field. No where else is it's use growing faster than in the multi-chip module market. It's inherent features in process ability, planarity, heat resistance, and patternability make it ideal for production use in multi chip modules.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 117
Copyright
Copyright © Materials Research Society 1990

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References

[1] Numata, S. et al, Polym. Prep. Jap., Vol.33, No.9, 2423 (1984)Google Scholar
[2] Numata, S. et al, Polyimides Vol.1, p.259, Plenum Press (1984)Google Scholar