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A New Polyimide for Multi-Chip Modules Applications
Published online by Cambridge University Press: 21 February 2011
Abstract
Currently polyimides are used for a multitude of applications in the electronics field. No where else is it's use growing faster than in the multi-chip module market. It's inherent features in process ability, planarity, heat resistance, and patternability make it ideal for production use in multi chip modules.
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- Copyright © Materials Research Society 1990
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