Hostname: page-component-cd9895bd7-8ctnn Total loading time: 0 Render date: 2024-12-27T18:48:55.309Z Has data issue: false hasContentIssue false
  • English
  • Français

Multiple Layers of Copper Thin Films of Alternating Textures

Published online by Cambridge University Press:  11 February 2011

Hanchen Huang ,
H. L. Wei ,
H. Y. Liang ,
C. H. Woo  and
X. X. Zhang
Hanchen Huang*
Affiliation:
Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180
H. L. Wei
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
H. Y. Liang
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
C. H. Woo
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
X. X. Zhang
Affiliation:
Department of Physics, Hong Kong University of Science and Technology, Hong Kong
*
* (email: [email protected])
Get access

Abstract

In this paper, we present a preliminary study of texture development during copper thin film deposition. Using direct current (DC) magnetron sputtering technique, we deposit copper films on a SiO2/Si(111) substrate. A thin layer of copper of <111> texture first develops, and another thin layer of <110> ensues. As deposition continues, a third layer of copper of <111> texture forms on the top, leading to a copper thin film of alternating <111> and <110> textures. The multiple layers of copper thin films of alternating textures form during continuous deposition without changing deposition conditions. The film morphology is characterized with scanning electron microscopy (SEM) and atomic force microscopy (AFM), and the texture with X-ray diffraction (XRD). Based on anisotropic elastic analyses and molecular dynamics simulations, we propose a model of texture evolution during the formation of multilayers, attributing the texture evolution to the competition of surface and strain energies.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 750: Symposium Y – Surface Engineering 2002–Synthesis, Characterization and Applications , 2002 , Y9.10
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tersoff, J., Teichert, C., and Lagally, M. G., Phys. Rev. Lett. 76, 1675 (1996).Google Scholar
2. Paul, A. and Lodha, G. S., Phys. Rev. B 65, 245416 (2002).Google Scholar
3. Huang, H., Gilmer, G. H., and Diaz, T. de la Rubia, J. Appl. Phys. 84, 3636 (1998);Google Scholar
Gilmer, G. H., Huang, H., Diaz de la Rubia, T., Torre, J. D., and Baumann, F., Thin Solid Films 365, 189 (2000);Google Scholar
Huang, H. and Gilmer, G. H., J. Computer-Aided Mater. Design 7, 203 (2001).Google Scholar
4. Huang, H., Wei, H. L., Woo, C. H., and Zhang, X. X., Appl. Phys. Lett. 81, 4359 (2002);Google Scholar
Wei, H. L., Huang, H., Woo, C. H., Zheng, R. K., Wen, G. H., and Zhang, X. X., Appl. Phys. Lett. 80, 2290 (2002).Google Scholar
5. Thompson, C. V. and Carel, R., J. Mech. Phys. Solids 44, 657 (1996).Google Scholar
6. Dong, L., Schnitker, J., Smith, R.W., and Srolovitz, D. J., J. Appl. Phys. 83, 217 (1998).Google Scholar