Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-25T18:00:26.521Z Has data issue: false hasContentIssue false
  • English
  • Français

Micro-Tensile and Fatigue Testing of Copper Thin Films on Substrates

Published online by Cambridge University Press:  10 February 2011

M. Hommel ,
O. Kraft ,
S. P. Baker  and
E. Arzt
M. Hommel
Affiliation:
Max-Planck-Institut für Metallforschung, Stuttgart, Germany
O. Kraft
Affiliation:
Max-Planck-Institut für Metallforschung, Stuttgart, Germany
S. P. Baker
Affiliation:
Dept. of Materials Science & Engineering, Cornell University, Ithaca, NY, USA
E. Arzt
Affiliation:
Max-Planck-Institut für Metallforschung, Stuttgart, Germany
Get access

Abstract

A special micro-tensile tester was used to carry out tensile tests of thin copper films on substrates. The elastic strain in the film was measured in-situ using x-ray diffraction and the total strain with an external strain gage. From the elastic strains the stresses in the films were calculated and stress-strain curves were obtained. It was observed that the flow stress increases with decreasing film thickness. The method was also applied to investigate the mechanical behavior of films under cyclic loading.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 546: Symposium AA – Materials Science of Microelectromechanical Systems (MEMS)… , 1998 , 133
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Nix, W. D., Met. Trans. 20A, 2217 (1989)Google Scholar
[2] Keller, R.-M., Baker, S. P. and Arzt, E., J. Mater. Res. 13, 1307 (1998)Google Scholar
[3] Courtney, T. H., Mechanical Behavior of Materials (Mc Graw-Hill Publishing Company, New York, 1990), p.171 Google Scholar
[4] Sanchez, J. E. Jr., Arzt, E., Scripta Met. et Mat. 27, 285 (1992)Google Scholar
[5] Hommel, M., Kraft, O., Arzt, E., submitted to J. Mater. Res.Google Scholar
[6] Kretschmann, A., Kuschke, W. -M., Baker, S. P., and Arzt, E. in Thin Films: Stresses and Mechanical Properties VII (Mat. Res. Soc. Proc. 436, Pittsburgh, PA 1996) pp. 59–64 Google Scholar
[7] Landolt-Börnstein, ; Numerical Data and Functional Relationships in Science and Technology - New Series, 11, Springer-Verlag (1979)Google Scholar
[8] Keller, R. -M., Kuschke, W. -M., Kretschmann, A., Bader, S., Vinci, R. P., and Arzt, E. in in Thin Films: Stresses and Mechanical Properties VI, (Mat. Res. Soc. Proc. 391, Pittsburgh, PA, 1995) pp. 309–314 Google Scholar