Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Allen, Charles W.
Schroeder, Herbert
and
Hiller, Jon M.
1999.
In Situ Study of Dislocation Behavior in Columnar Al Thin Film on Si Substrate During Thermal Cycling.
MRS Proceedings,
Vol. 594,
Issue. ,
Lee, S.-Y.
Choi, S.-H.
and
Park, C.-O.
2000.
Oxidation, grain growth and reflow characteristics of copper thin films prepared by chemical vapor deposition.
Thin Solid Films,
Vol. 359,
Issue. 2,
p.
261.
Dehm, G
Weiss, D
and
Arzt, E
2001.
In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate.
Materials Science and Engineering: A,
Vol. 309-310,
Issue. ,
p.
468.
Baker, S.P
Kretschmann, A
and
Arzt, E
2001.
Thermomechanical behavior of different texture components in Cu thin films.
Acta Materialia,
Vol. 49,
Issue. 12,
p.
2145.
Latt, Khin Maung
Lee, Y.K
Li, S
Osipowicz, T
and
Seng, H.L
2001.
The impact of layer thickness of IMP-deposited tantalum nitride films on integrity of Cu/TaN/SiO2/Si multilayer structure.
Materials Science and Engineering: B,
Vol. 84,
Issue. 3,
p.
217.
Latt, Khin Maung
Lee, Kangsoo
Osipowicz, Thomas
and
Lee, Y.K
2001.
Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure.
Materials Science and Engineering: B,
Vol. 83,
Issue. 1-3,
p.
1.
Legros, M.
Hemker, K.J.
Gouldstone, A.
Suresh, S.
Keller-Flaig, R.-M.
and
Arzt, E.
2002.
Microstructural evolution in passivated Al films on Si substrates during thermal cycling.
Acta Materialia,
Vol. 50,
Issue. 13,
p.
3435.
Weihnacht, V.
and
Brückner, W.
2002.
Abnormal grain growth in {111} textured Cu thin films.
Thin Solid Films,
Vol. 418,
Issue. 2,
p.
136.
Zhang, Jian-min
Xu, Ke-wei
and
Ji, Vincent
2003.
Experiment and simulation of grain growth in a bidimensional polycrystalline film.
Applied Surface Science,
Vol. 218,
Issue. 1-4,
p.
268.
Gregoire, M.
Kordic, S.
Gergaud, P.
Thomas, O.
and
Ignat, M.
2005.
Thermomechanical Behavior and Properties of Passivated Pvd and Ecd Cu Thin Films.
MRS Proceedings,
Vol. 875,
Issue. ,
Legros, Marc
2014.
In situ mechanical TEM: Seeing and measuring under stress with electrons.
Comptes Rendus Physique,
Vol. 15,
Issue. 2-3,
p.
224.
Ross, Frances M.
and
Minor, Andrew M.
2019.
Springer Handbook of Microscopy.
p.
101.