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High-Aspect-Ratio Micromachining of Fluoropolymers Using Focused Ion Beam
Published online by Cambridge University Press: 01 February 2011
Abstract
Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate by using FIB. Gasification of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTFE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.
- Type
- Research Article
- Information
- MRS Online Proceedings Library (OPL) , Volume 1020: Symposium GG – Ion-Beam-Based Nanofabrication , 2007 , 1020-GG02-09
- Copyright
- Copyright © Materials Research Society 2007