Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-25T18:03:03.423Z Has data issue: false hasContentIssue false
  • English
  • Français

Finite Element Simulation of Indentation Behavior of thin Films

Published online by Cambridge University Press:  22 February 2011

D. T. Madsen ,
R. J. Giovinazzo  and
J. E. Ritter
D. T. Madsen
Affiliation:
Department of Mechanical Engineering, T.J. Lardner, Department of Civil Engineering, University of Massachusetts, Amherst, MA 01003
R. J. Giovinazzo
Affiliation:
Department of Mechanical Engineering, T.J. Lardner, Department of Civil Engineering, University of Massachusetts, Amherst, MA 01003
J. E. Ritter
Affiliation:
Department of Mechanical Engineering, T.J. Lardner, Department of Civil Engineering, University of Massachusetts, Amherst, MA 01003
Get access

Abstract

Nanoindentation experiments are now widely used to study the elastic and plastic properties of thin films. Simulation of these experiments has been performed using finite element analysis. Results show the large influence that pile-up or sink-in behavior have on hardness calculations. Results also show that a compliant substrate significantly affects the measured hardness of a stiffer coating. The measured hardness of a compliant coating is less effected by a stiffer substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 431
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hibbitt, , Karlsson, , and Sorensen, , Inc., 1989, ABAQUS Finite Element Program, HKS Inc., Providence, RI.Google Scholar
2. Joslin, D.L. and Oliver, W.C., J. Mater. Res., 5 (1), 123–126 (1990).Google Scholar
3. Sneddon, I.N., Int. Jour. Eng. Sci., 3 47–57 (1965).Google Scholar
4. Pethica, J.B., Hutchings, R., and Oliver, W.C., Phil. Mag. A, 48 (4), 607–621 (1983).Google Scholar
5. Bhattacharya, A.K. and Nix, W.D., Int. J. Solids Structures, 24 (9), 881–891 (1988).Google Scholar
6. Doerner, M.F. and Nix, W.D., J. Mater. Res., 1 (4), 601–609 (1986).Google Scholar
7. Burnett, P.J. and Rickerby, D.S., Thin Solid Films, 148 41–50 (1987).Google Scholar
8. Bhattacharya, A.K. and Nix, W.D., Int. J. Solids Structures, 24 (12), 1287–1298 (1988).Google Scholar
9. Stone, D., LaFontaine, W.R., Alexopoulos, P., Wu, T.W., and Li, C.-Y., J. Mater. Res., 3 (1), 141–147 (1988).Google Scholar