Hostname: page-component-78c5997874-lj6df Total loading time: 0 Render date: 2024-11-19T04:18:46.833Z Has data issue: false hasContentIssue false

Field Emission Device Made from Multiwalled Carbon Nanotube Sheet

Published online by Cambridge University Press:  30 March 2012

Hai H. Van
Affiliation:
Department of Industrial and Manufacturing Engineering, FAMU-FSU College of Engineering; High-Performance Materials Institute, Florida State University, 2525 Pottsdamer Street, Tallahassee, FL 32310, U.S.A.
Mei Zhang
Affiliation:
Department of Industrial and Manufacturing Engineering, FAMU-FSU College of Engineering; High-Performance Materials Institute, Florida State University, 2525 Pottsdamer Street, Tallahassee, FL 32310, U.S.A.
Ben Wang
Affiliation:
Department of Industrial and Manufacturing Engineering, FAMU-FSU College of Engineering; High-Performance Materials Institute, Florida State University, 2525 Pottsdamer Street, Tallahassee, FL 32310, U.S.A.
Chuck Zhang
Affiliation:
Department of Industrial and Manufacturing Engineering, FAMU-FSU College of Engineering; High-Performance Materials Institute, Florida State University, 2525 Pottsdamer Street, Tallahassee, FL 32310, U.S.A.
Get access

Abstract

A new type of cathode for electron field emission (FE) was fabricated. The cathode was made from ultra-thin multiwalled carbon nanotube (CNT) sheets. These sheets were drawn directly from a CNT forest, stacked layer-by-layer together and densified by isopropyl alcohol. CNT emitters were formed by utilizing laser beam to cut the sheet. The FE performance of the proposed devices has been enhanced dramatically. The threshold field for electron emission (at which the emission current is 10 mA/cm2) was 0.88 V/μm. The current density of 36 A/cm2 was achieved at the electric field of 2 V/μm. The enhanced performance is the result of the thin, uniformly distributed and aligned array of the CNT emitters.

Type
Research Article
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Popov, V., Materials Science and Engineering: R: Reports 43, 61102 (2004).Google Scholar
2. Heer, W. a. d., Chatelain, A., and Ugarte, D., Science 270, 11791180 (1995).Google Scholar
3. Jeong, H. J., Jeong, H. D., Kim, H. Y., Kim, J. S., Jeong, S. Y., Han, J. T., Bang, D. S., and Lee, G. W., Advanced Functional Materials 21, 15261532 (2011).Google Scholar
4. Jian, S. K. C., Ho, J. R., and Cheng, J. W. J., Solid State Communications 150, 666668 (2010).Google Scholar
5. Yu, J. and Chua, D. H. C., Journal of Materials Science 46, 48584863 (2011).Google Scholar
6. Vieira, S. M. C., Teo, K. B. K., Milne, W. I., Groning, O., Gangloff, L., Minoux, E., and Legagneux, P., Applied Physics Letters 89, 022111 (2006).Google Scholar
7. Cheung, C. L., Hafner, J. H., Odom, T. W., Kim, K., and Lieber, C. M., Applied Physics Letters 76, 3136 (2000).Google Scholar
8. Ribaya, B. P., Leung, J., Brown, P., Rahman, M., and Nguyen, C. V., Nanotechnology 19, 185201 (2008).Google Scholar
9. Chen, G., Shin, D. H., Roth, S., and Lee, C. J., Nanotechnology 20, 315201 (2009).Google Scholar
10. Yang, Y., Liu, L., Wei, Y., Liu, P., Jiang, K., Li, Q., and Fan, S., Carbon 48, 531537 (2010).Google Scholar
11. Zhang, M., Fang, S., Zakhidov, A. a., Lee, S. B., Aliev, A. E., Williams, C. D., Atkinson, K. R., and Baughman, R. H., Science 309, 12151219 (2005).Google Scholar
12. Jo, S. H., Tu, Y., Huang, Z. P., Carnahan, D. L., Wang, D. Z., and Ren, Z. F., Applied Physics Letters 82, 3520 (2003).Google Scholar
13. Cheng, Y., Comptes Rendus Physique 4, 10211033 (2003).Google Scholar
14. Suh, J. S., Jeong, K. S., Lee, J. S., and Han, I., Applied Physics Letters 80, 2392 (2002).Google Scholar
15. Chhowalla, M., Ducati, C., Rupesinghe, N. L., Teo, K. B. K., and Amaratunga, G. A. J., Applied Physics Letters 79, 2079 (2001).Google Scholar
16. Bonard, J. M., Weiss, N., Kind, H., Stöckli, T., Forró, L., Kern, K., and Chatelain, A., Advanced Materials 13, 184188 (2001).Google Scholar