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Fabrication of PLZT Film-on-Foil Dielectric Sheets for Embedded Passives1
Published online by Cambridge University Press: 15 March 2011
Abstract
Ferroelectric film-on-foil capacitors hold special promise to replace discrete passive components in the development of electronic devices that require greater performance and smaller size. We have deposited Pb0.92La0.08Zr0.52Ti0.48O3 (PLZT) films on base metal foils to form film-on-foil capacitor sheets that can be embedded into printed circuit boards. The rootmean-square surface roughness was determined to be ≍3 nm for 1.15-μm-thick PLZT films on LaNiO3-buffered Ni foils. The following dielectric properties were measured: relative permittivity of ≍1300 and dielectric loss (tan δ) of ≍0.05, leakage current density of 6.6 × 10−9 A/cm2 at 25°C and 1.4 × 10−8 A/cm2 at 150°C, and mean breakdown strength >2.5 MV/cm. A remnant polarization (Pr) of ≍33 μC/cm2 and coercive field strength (Ec) of ≍50 kV/cm were observed with a maximum voltage of 300 V applied during the P-E loop measurement. The energy storage capability of the dielectric film is ≍45 J/cm3.
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- Copyright © Materials Research Society 2009
Footnotes
The submitted manuscript has been created by UChicago Argonne, LLC, Operator of Argonne National Laboratory (“Argonne”). Argonne, a U.S. Department of Energy Office of Science laboratory, is operated under Contract No. DE-AC02-06CH11357. The U.S. Government retains for itself, and others acting on its behalf, a paidup nonexclusive, irrevocable worldwide license in said article to reproduce, prepare derivative works, distribute copies to the public, and perform publicly and display publicly, by or on behalf of the Government.