Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-23T16:09:13.365Z Has data issue: false hasContentIssue false
  • English
  • Français

Fabrication of Multiwall Carbon Nanotube-nanocrystalline Copper Nanocomposite Film by Electrochemical Deposition

Published online by Cambridge University Press:  01 February 2011

JungJoon Yoo ,
JaeYong Song  and
Jin Yu
JungJoon Yoo
Affiliation:
[email protected], Korea Advanced Institute of Science and Technology, Department of Materials Science and Engineering, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea, Republic of, +82-42-869-4274, +82-42-869-8840
JaeYong Song
Affiliation:
[email protected], Korea Research Institute of Standards and Science, Division of Advanced Technology, 1 Doryong-dong, Yuseong-gu, Daejeon, 305-600, Korea, Republic of
Jin Yu
Affiliation:
[email protected], Korea Advanced Institute of Science and Technology, Department of Materials Science and Engineering, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea, Republic of
Get access

Abstract

A new method of fabricating nanocomposite films made up of multiwall carbon nanotube and nanocrystalline copper was developed by using an electrochemical deposition. The electroplated CNT/Cu nanocomposites have the microstructure that CNTs are well dispersed in both the planar and depth directions without any voids in the matrix. The conditions were successfully achieved by using some amphiphilic polymers, organic additives and a pulse electrodeposition method. The microstructure and CNT composition of nanocomposite films were strongly affected by the concentration of CNT in the electrolyte. The mechanical and electrical properties of CNT/Cu nanocomposite films were investigated with the variation of CNT content in the nanocomposite films.

Keywords

compositenanostructureelectrodeposition
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1056: Symposium HH – Nanophase and Nanocomposite Materials V , 2007 , 1056-HH09-08
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Baughman, R. H., Zakhidov, A. A. and Heer, W. A. de, Science 297, 787 (2002)Google Scholar
2. Dai, H., Surf. Sci. 500, 218 (2002)Google Scholar
3. Thostenson, E. T., Ren, Z. and Chou, T.-W., Compos. Sci. Technol. 61, 1899 (2001)Google Scholar
4. FLAHAUT, E., PEIGNEY, A., LAURENT, Ch., MARLIÉRE, Ch., CHASTEL, F. and ROUSSET, A., Acta mater. 48, 3803 (2000)Google Scholar
5. Zhan, G., Kuntz, J. D., Wan, J. and Mukherjee, A. K., Nat. mater. 2, 38 (2002)Google Scholar
6. Yang, Z., Xu, H., Shi, Y., Li, M., Huang, Y. and Li, H., Mater. Res. Bull. 40, 1001 (2005)Google Scholar
7. Arai, S., Endo, M., Sato, T. and Koidec, A., Electrochem. Solid-State Lett., 9, C131 (2006)Google Scholar
8. Chena, W. X., Tub, J. P., Wangb, L. Y., Gana, H. Y., Xua, Z. D. and Zhang, X.B., Carbon, 41, 215 (2003)Google Scholar
9. Cha, S. I., Kim, K. T., Arshard, S. N., Mo, C. B. and Hong, S. H., Adv. Mater. 17, 1377 (2005)Google Scholar
10. Kim, U. J., Furtado, C. A., Liu, X., Chen, G. and Eklund, P. C., J. Am. Chem. Soc. 127, 15437 (2005)Google Scholar
11. Furtado, C. A., Kim, U. J., Gutierrez, H. R., Pan, Ling, Dickey, E. C., and Eklund, Peter C., J. Am. Chem. Soc. 126, 6095 (2004)Google Scholar
12. Yurekli, K., Mitchell, C. A., and Krishnamoorti, R., J. Am. Chem. Soc. 126, 9902 (2004)Google Scholar
13. Natter, H. and Hempelmann, R., J. Phys. Chem. 100, 19525 (1996)Google Scholar
14. Tao, S. and Li, D. Y., Nanotechnology, 17, 65 (2006)Google Scholar