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Evaluation of the Electromigration Performance of New Aluminium Via Plug-Fill Techniques for 0.25μm and 0.18μm Technologies
Published online by Cambridge University Press: 10 February 2011
Abstract
The electromigration performance of samples fabricated with new Al via-filling techniques are studied and compared. The new techniques are (1) Hot Al mono-chamber and (2) CVD/PVD Al. Their electromigration performances are assessed over a range of stress conditions and compared with that of a standard W- etchback technique.
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- Copyright © Materials Research Society 1998