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Electrical Characteristics of Doped and Undoped High Dielectric Constant BCTZ Thin Films

Published online by Cambridge University Press:  21 March 2011

Woo-Chul Yi
Affiliation:
Microelectronics Research Laboratories, Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO 80933-7150
T. S. Kalkur
Affiliation:
Microelectronics Research Laboratories, Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO 80933-7150
Elliott Philofsky
Affiliation:
Applied Ceramics Research Company, Colorado Springs, 80919
Lee Kammerdiner
Affiliation:
Applied Ceramics Research Company, Colorado Springs, 80919
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Abstract

Ba1−xCaxTi1-yZryO3 materials have very high dielectric constant (up to 30,000) in the bulk form. In this paper, we are presenting the electrical and structural characteristics of undoped and 0.4% Mg-doped Ba0.96Ca0.04Ti0.84Zr0.16O3 (BCTZ) thin films on Pt/Ti/SiO2/Si substrates. The BCTZ films were deposited by spin on metal-organic decomposition method and annealed at a temperature 600-900°C in oxygen environment. The annealed thin films were characterized by X-ray diffraction. The electrical characteristics of the annealed thin films were analyzed by capacitance–voltage and current–voltage measurements. The as-annealed thin films were post- annealed in nitrogen and oxygen environments and the effect of post-annealing on their electrical characteristics were also presented in conjunction with 0.4% Mg doping effect of BCTZ thin films for possible high dielectric constant material applications.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Hoffmann, S. and Waser, R. M., Integr. Ferroelectrics 17,141(1997).Google Scholar
2. Hansen, P., Henning, D., and Schreinemacher, H., J. Am. Ceram. Soc. 81, 1369 (1998).Google Scholar
3. Shannon, R. D., Acta Crystallogr. A32, 751 (1976).Google Scholar
4. Powder Diffraction File (International Center for Diffraction Data, Swarthmore, PA, 1995) JCPDS card 36–19.Google Scholar
5. Thomas, R., Dube, D. C., Kamalasanan, M. N., and Chandra, S., Thin Solid Films 346, 212 (1999).Google Scholar
6. Wu, T.-B., Wu, C.-M., and Chen, M.-L., Thin Solid Films 334, 77 (1998); H.-J. Shy and T.-B. Wu, Jpn. J. Appl. Phys. Part 1 37, 4049 (1998); D. Wu, A. Li, H. Ling, X. Yin, C. Ge, M. Wang, and N. Ming, Appl. Surf. Sci. 165, 309 (2000).Google Scholar
7. In, T.-G., Baik, S., and Kim, S., J. Mat. Res. 13, 990 (1998).Google Scholar
8. Ang, C., Yu, Z., and Cross, L. E., Phys. Rev. B 62, 228 (2000); Y. Shimakawa and Y. Kubo, Appl. Phys. Lett. 77, 2590 (2000).Google Scholar
9. Im, J., Streiffer, S. K., Auciello, O., and Krauss, A. R., Appl. Phys. Lett. 77, 2593 (2000); J.-H. Joo, J.-M. Seon, Y.-C. Jeon, K.-Y. Oh, J.-S. Roh, and J.-J. Kim, ibid. 70, 3053 (1997).Google Scholar