Hostname: page-component-cd9895bd7-q99xh Total loading time: 0 Render date: 2024-12-27T18:27:15.208Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of Deposition and Annealing on The Thermomechanical Properties of Parylene Films

Published online by Cambridge University Press:  15 February 2011

E. Todd Ryan ,
Mikel Miller  and
Paul S. Ho
E. Todd Ryan
Affiliation:
Center for Materials Science and Engineering, University of Texas at Austin, Austin, Texas 78712
Mikel Miller
Affiliation:
Center for Materials Science and Engineering, University of Texas at Austin, Austin, Texas 78712
Paul S. Ho
Affiliation:
Center for Materials Science and Engineering, University of Texas at Austin, Austin, Texas 78712
Get access

Abstract

Parylene polymers are vapor deposited and form semicrystalline films. The properties of these films vary with chemical structure, molecular weight, and morphology. The properties of parylene films deposited by changing the standard deposition process are evaluated and compared to control films. The thermomechanical properties of films produced by three modified processes, A, P, and PC, indicate the modified processes reduce the molecular weight. The films were also annealed to determine the stability of the film's properties during thermal cycling. These results also suggest that the modified films are lower molecular weight materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 476: Symposium N – Low-Dielectric Constant Materials III , 1997 , 225
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Singer, P., Semicond. Int. (May), 88 (1996).Google Scholar
2. Leu, J., Lee, J.K., Kasthurirangan, J., Liao, C.N., Ho, P.S., and Ting, C.H., Evaluation of Low k Dielectric Materials for Interconnect Applications, presented at the SRC Topical Research Conference on Low Dielectric Constant Interlayer Dielectrics for High Performance Circuits, Rensselaer Polytechnic Institute, Troy, NY, Aug. 9–10, 1994.Google Scholar
3. Wary, J., Olson, R., and Beach, W., Semicond. Int. (June), 211 (1996).Google Scholar
4. Kirkpatrich, D.E. and Wunderlich, W., J. Polym. Sci. Polym. Phys. Ed. 24, 931 (1986).Google Scholar
5. Miller, K.J., Hollinger, H.B., Grebowicz, J. and Wunderlich, W., Macromolec. 23, 3855 (1990).Google Scholar
6. Kirkpatrich, D.E. and Wunderlich, W., Macromolec. Chem. 186, 2595 (1985).Google Scholar
7. Gorham, W.F., J. Polym. Sci. A-l, 4, 3027 (1966).Google Scholar
8. The 543 cm−1 vibration is tentatively assigned as the ring C-C out-of-plane deformation for a para substituted benzene. It may also be due to the in-plane bending of the C=C-C-C ethyl benzene group.Google Scholar
9. Socrates, G., Infrared Characteristic Group Frequencies. (Wiley. New York, 1994).Google Scholar