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Cross-Section Nano-Indentation for Rapid Adhesion Evaluation
Published online by Cambridge University Press: 17 March 2011
Abstract
Cross-section nano-indentation is a technique that consists of cleaving a wafer, indenting behind the stack on the side surface causing delamination, and measuring the delaminated area in an optical microscope. It is shown to be a reliable rapid technique for adhesion evaluation and process optimization of the SiO2/barrier/copper stack.
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- Research Article
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- Copyright © Materials Research Society 2004
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