Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by Crossref.
Scorzoni, A.
De Munari, I.
Stulens, H.
and
D’Haeger, V.
1996.
Non-linear resistance behavior in the early stages and after electromigration in Al-Si lines.
Journal of Applied Physics,
Vol. 80,
Issue. 1,
p.
143.
Rinne, Glenn A.
2003.
Issues in accelerated electromigration of solder bumps.
Microelectronics Reliability,
Vol. 43,
Issue. 12,
p.
1975.
Rinne, G.
2003.
Time dependant materials issues in the electromigration of solder bumps.
p.
177.