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A Critical Regime for AMorphization of Ion ImplantedSilicon

Published online by Cambridge University Press:  15 February 2011

R. D. Goldberg
Affiliation:
Department of Electronic Materials Engineering, Australian National University, Canberra, 0200, Australia.
J. S. Williams
Affiliation:
Department of Electronic Materials Engineering, Australian National University, Canberra, 0200, Australia.
R. G. Elliman
Affiliation:
Department of Electronic Materials Engineering, Australian National University, Canberra, 0200, Australia.
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Abstract

A critical regime has been identified for ion implanted silicon where onlyslight changes in temperature can dramatically affect the levels of residualdamage. In this regime decreases of only 5° C aie sufficient to induce acrystalline-to-amorphous transformation in material which only exhibited thebuild-up of extended defects at higher temperatures. Traditional Models ofdamage accumulation and amorphization have proven inapplicable to thisregime which exists whenever dynamic defect annealing and damage productionare closely balanced. Irradiating ion flux, Mass and fluence have all beenshown to influence the temperature—which varies over a range of 300° C forion species ranging from C to Xe—at which the anomalous behaviour occurs.The influence of ion fluence suggests that complex defect accumulation playsan important role in amorphization. Results are presented which furthersuggest that the process is nucleation limited in this critical regime.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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