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Chemical-Mechanical Polishing of Polymer Films: Comparison of Benzocyclobutene(BCB) and Parylene-N Films by XPS and AFM

Published online by Cambridge University Press:  15 February 2011

G.-R. Yang ,
Y.-P. Zhao ,
Jan M. Neirynck ,
Shyam P. Murarka  and
Ronald J. Gutmann
G.-R. Yang
Affiliation:
Department of Physics, Applied Physics, and Astronomy, Center for Integrated Electronics and Electronic Manufacturing, Rensselaer Polytechnic Institute, Troy, NY 12180
Y.-P. Zhao
Affiliation:
Department of Physics, Applied Physics, and Astronomy, Center for Integrated Electronics and Electronic Manufacturing, Rensselaer Polytechnic Institute, Troy, NY 12180
Jan M. Neirynck
Affiliation:
Department of Electrical, Computer, and Systems Engineering, Center for Integrated Electronics and Electronic Manufacturing, Rensselaer Polytechnic Institute, Troy, NY 12180
Shyam P. Murarka
Affiliation:
Department of Materials Science and Engineering, Center for Integrated Electronics and Electronic Manufacturing, Rensselaer Polytechnic Institute, Troy, NY 12180
Ronald J. Gutmann
Affiliation:
Department of Electrical, Computer, and Systems Engineering, Center for Integrated Electronics and Electronic Manufacturing, Rensselaer Polytechnic Institute, Troy, NY 12180
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Abstract

The quality of benzocyclobutene (BCB) and Parylene-N (PA-N) films after chemical-mechanical polishing (CMP) is influenced by 3 factors: slurry composition, quality of the as-deposited film or post-deposition treated film, and polishing time. The quality of the films has been investigated by using X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). It is shown that the higher the quality of the as-deposited film (or post-deposition treated film), the higher the quality of the polished film. The polishing time has little effect on the surface characteristics of high quality PA-N films, however it has an effect on BCB film. This is attributed to the structure and thermal-stability and higher chemical resistance of PA-N. The RMS surface roughness measured by AFM, for as-deposited PA-N is 90Å. The roughness after CMP processes is greater than 200Å. The roughness for as-spin-coated and polished BCB film is 5A, and 20Å, respectively. The morphology of the PA-N film, either as-deposited or polished, is not as good as the BCB film. A slurry which is good for BCB polishing is not good for PA-N polishing, and vice versa. These results indicate that the nature of the polymer film, including its chemical structure as well as the quality of the as-deposited/post-deposition treated film, plays an important role in polymer CMP.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 476: Symposium N – Low-Dielectric Constant Materials III , 1997 , 161
Copyright
Copyright © Materials Research Society 1997

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References

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