Hostname: page-component-cd9895bd7-8ctnn Total loading time: 0 Render date: 2024-12-27T18:24:02.907Z Has data issue: false hasContentIssue false

Chemical Vapor Deposition and Defect Characterization of Silicon Carbide Epitaxial Films

Published online by Cambridge University Press:  01 February 2011

Yi Chen
Affiliation:
[email protected], Stony Brook University, Materials Science and Engineering, 314 Old Engineering, SUNY-Stony Brook, Stony Brook, NY 11794-2275, Stony Brook, NY, 11794-2275, United States, 631-632-4993, 631-632-8052
Govindhan Dhanaraj
Affiliation:
[email protected], Stony Brook University, Department of Materials Science and Engineering, United States
Hui Chen
Affiliation:
[email protected], Stony Brook University, Department of Materials Science and Engineering, United States
William Vetter
Affiliation:
[email protected], Stony Brook University, Department of Materials Science and Engineering, United States
Michael Dudley
Affiliation:
Stony Brook University, Department of Materials Science and Engineering, United States
Hui Zhang
Affiliation:
[email protected], Stony Brook University, Department of Mechanical Engineering, United States
Get access

Abstract

SiC homo-epitaxial layers have been grown using a halide chemical vapor deposition (HCVD) process. The thermodynamic process of SiC CVD in SiCl4-C3H8-H2 gas system was studied using equilibrium model. The predicted growth rate decreases gradually with the increase in growth temperature, and this trend is consistent with our experimental results. Good quality epitaxial layers with low density of basal plane dislocations could be grown. Some elementary screw dislocations present in the substrate do not seem to be propagating into the epitaxial layer.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hingorani, N.G. and Stahlkopf, K. E., Scientific American 269, 78 (1993)Google Scholar
2. Bhatnagar, M. and Baliga, B. J., IEEE Transactions on Electron Devices 40, 645 (1993)Google Scholar
3. Baliga, B. J., Proceedings of the IEEE 82, 1112 (1994)Google Scholar
4. Matsunami, H., Physica B 185, 65 (1993)Google Scholar
5. Kordina, O., Hallin, C., Ellison, A., Bakin, A. S., Ivanov, I. G., Henry, A., Yakimova, R., Touminen, M., Vehanen, A. and Janzen, E., Appl. Phys. Lett. 69, 1456 (1996)Google Scholar
6. Fanton, M. A., Skowronski, M., Snyder, D. W., Chung, H. J., Nigam, S., Weiland, B. E. and Huh, S. W., Materials Research Forum 457–460, 87 (2004)Google Scholar
7. Chung, H. J., Polyakov, A. Y., Huh, S. W., Nigam, S., Skowronski, M., Fanton, M. A., Weiland, B. E., and Snyder, D. W., J. Appl Phys. 97, Art. No. 084913 (2005)Google Scholar
8. Carter, C.H. Jr, Tsvetkov, V.F., Glass, R. C., Henshall, D., Brady, M., Muller, St. G., Kordina, O., Irvine, K., Edmond, J. A., Kong, H. S., Singh, R., Allen, S. T. and Palmour, J. A., Mater. Sci. Eng. B 61–62, 1 (1999)Google Scholar
9. Glass, R. C., Henshall, D., Tsvetkov, V. F. and Carter, C. H. Jr, MRS Bulletin 22, 30 (1997)Google Scholar
10. Dhanaraj, G., Huang, X.R., Dudley, M., Prasad, V. and M, R.H., chapter 6, p181232 in “Crystal Growth Technology”, Eds Byrappa, K., Ohachi, T., William Andrew co-published with Springer, NY 2003 Google Scholar
11. Huang, X. R., Dudley, M., Vetter, W. M., Huang, W. and Wang, S., Appl. Phy. Lett. 74, 353 (1999)Google Scholar
12. Dhanaraj, G., Chen, Y., Dudley, M. and Zhang, H., Proceeding of International Conference on Silicon Carbide and Related Materials 2005 (accepted)Google Scholar
13. Dhanaraj, G., Dudley, M., Chen, Y., Ragothamachar, B., Wu, B. and Zhang, H., J. Cryst. Growth 287, 344 (2006)Google Scholar
14. Kingon, A. I., Lutz, L. J., Liaw, P. and Davis, R. F., J. Am. Ceram. Soc. 66, 558 (1983)Google Scholar
15. Fischman, G. S. and Petuskey, W. T., J. Am. Ceram. Soc. 68, 185 (1985)Google Scholar
16. Chen, Y., Dhanaraj, G. and Dudley, M., to be publishedGoogle Scholar