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Ceramic/Polymer Nanocomposite Properties for Microelectronic Packages

Published online by Cambridge University Press:  21 February 2011

Amitabh Das ,
Thallam T. Srinivasan  and
Robert E. Newnham
Amitabh Das
Affiliation:
Materials Research Laboratory, The Pennsylvania State University, University Park, PA16802.
Thallam T. Srinivasan
Affiliation:
Materials Research Laboratory, The Pennsylvania State University, University Park, PA16802.
Robert E. Newnham
Affiliation:
Materials Research Laboratory, The Pennsylvania State University, University Park, PA16802.
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Abstract

This paper reviews some of the research efforts in microelectronic packaging to develop composites with dimensions of the fillers ranging down to nanometer dimensions. Some initial experiments have been conducted with nanocomposites, where the thermal and dielectric properties of polymer/fumed silica composites have been studied. The bulk samples were prepared in different ratios of polymer to silica using polydimethyl siloxane and Cab-O-Sil. Differential thermal analyses carried out on these samples showed no changes in the samples till 330°C. The dielectric constant of the 70:30 (Cab-O-Sil- Polymer by Wt.%) composite is 3.8, similar to that of the pure silica. For the same composite the value of the thermal expansion coefficient is 350 ppm, closer to the value of pure polymer (439 ppm). It is suggested that the key to model these nanocomposites with ceramic and polymer phases is to understand the interfaces and their chemical bonding.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 165
Copyright
Copyright © Materials Research Society 1990

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References

1. Tummala, Rao R. and Rymaszewski, Eugene J., Microelectronic Packaging Handbook, (Van Nostrand Reinhold, New York, 1989), p. 3.Google Scholar
2. Personal communications with Gupta, T., ALCOA.Google Scholar
3. Blodgett., A.J. Jr., Sci. Amer. 249 (1), 86 (1983).Google Scholar
4. Schwartz, B., Ceram. Bull., 63 (4), 577 (1984).Google Scholar
5. Das, A., and Cross, L.E., Proceedings of the Ninth Annual International Electronics Packaging Conference, San Diego, California, September 11–13, 2, p. 1223, (1989).Google Scholar
6. Newnham, R.E., Ann. Rev. Mater. Sci., 16, 47 (1986).Google Scholar
7. Newnham, R.E., Ferroelectrics, 68, 1 (1986).Google Scholar
8. Wang, D.W., Mat. Res. Soc. Symp. 108, p. 125 (1987).Google Scholar
9. Seibold, R.W., Lamoureux, R.T. and Goodman, S.H., Mat. Res. Soc. Symp. 108, p. 141 (1987).Google Scholar
10. Klemens, P.G., International J. of Thermophysics, 9 (2), 171 (1988).Google Scholar
11. Turner, P.S., J. Res. Bur. Std., 37 239 (1946).Google Scholar
12. Fahmy, A.A., and Ragai, A.N., J. Appl. Phys., 41 (13), 5108 (1970).Google Scholar
13. McElroy, D.L., Weaver, F.J. and Bridgeman, C., International J. of Thermophysics, 9 (2), 233 (1988).Google Scholar
14. Dudek, J.A., and Kargol, J.A., International J. of Thermophysics, 9 (2), 245 (1988).Google Scholar
15. Yamamoto, J.K., Dielectric Properties Of Porous Glass In The Microwave Region. M. S Thesis, The Pennsylvania State University, December (1986).Google Scholar
16. Yarbrough, W.A., Gururaja, T.R., Cross, L.E., Am. Ceram. Soc. Bull., 66 (4), 692 (1987).Google Scholar
17. Mohideen, U., Ultra-low Permittivity Porous Silica Thick Films For GaAs IC Packaging, M.S. Thesis, The Pennsylvania State University, December (1987).Google Scholar
18. M.J. Leap, The Processing and Electrical Properties of Hollow Microsphere Composites, M.S. Thesis, The Pennsylvania State University, May (1989)Google Scholar
19. Sliva, P., The Development and Processing Of Calcium Aluminate Cement As a Low Relative Dielectric Permittivity Material, Ph.D Thesis, The Pennsylvania State University, December (1988).Google Scholar
20. A. Das. Sputter Deposited Silica Films As Substrates For Microelectronic Packaging Applications, Ph.D Thesis, The Pennsylvania State University, August (1988).Google Scholar
21. Das, A., Messier, R., Gururaja, T.R., Cross, L.E., Proc. Spring MRS meeting, Palo Alto, Ca, April (1986).Google Scholar
22. Rittenmyer, K., Shrout, T., Schulze, W.A. and Newnhamn, R.E., Ferroelectrics, 41, 189 (1982).Google Scholar
23. Sullivan, C.A., The Use Of Synthetic Organic Templates In The Preparation Of Tailored Ceramic Microstructure, M.S. Thesis, The Pennsylvania State University, December (1989).Google Scholar
24. Niklasson, G.A., and Craighead, H.G., App. Optics. 22, 1237 (1983).Google Scholar
25. Borel, J.P., Sur. Sci. 106, 1, (1981).Google Scholar
26. Uchino, K., Sadanaga, E., Hirose, T., J. Amer. Ceram. Soc. (to be published in 1989).Google Scholar
27. Ishikawa, K., Phys. Rev. B 37, 5852 (1988).Google Scholar
28. Garvie, R.C., J. of Phy. Chem. 69 (4), 1238 (1965).Google Scholar
29. Schmidt, H., Proceedings of The Nanocomposite Conference, Tokyo, (1989).Google Scholar
30. Ravaine, D., Seminel, A., Charbouillot, Y., and Vincens, M., J. of Non-Crystalline Solids. 82 210 (1986).Google Scholar
31. Schmidt, H., J. of Non-Crystalline Solids. 73, 681 (1985).Google Scholar