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Application of a Chemically Adsorbed Monolayer and Polypyrrole Thin Film for Increasing the Adhesion Force between the Resin Substrate and the Plated Copper Layer

Published online by Cambridge University Press:  01 February 2011

Yuji Ohkubo ,
Shogo Onishi ,
Satoshi Miyazawa ,
Kazuhiro Soejima  and
Kazufumi Ogawa
Yuji Ohkubo
Affiliation:
[email protected], Graduate school of engineering Kagawa, Advanced Materials Science, Takamatsu, Japan
Shogo Onishi
Affiliation:
[email protected], Graduate school of engineering Kagawa, Advanced Materials Science, Takamatsu, Japan
Satoshi Miyazawa
Affiliation:
[email protected], Alps Electric Co., Ltd., Business development hq process technology dvlpmt.Center, Sendai, Japan
Kazuhiro Soejima
Affiliation:
[email protected], Alps Electric Co., Ltd., Business development hq process technology dvlpmt.Center, Sendai, Japan
Kazufumi Ogawa
Affiliation:
[email protected], Graduate school of engineering Kagawa, Advanced Materials Science, Takamatsu, Japan
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Abstract

A chemically adsorbed monolayer containing pyrrolyl group (Pyrrolyl-CAM) was prepared between a plated copper layer and a resin substrate for increasing the adhesion force without roughening a surface of the resin substrate. Although it was not enough to increase the adhesion force between the resin substrate and the copper layer by using only Pyrrolyl-CAM, the sufficient adhesion force was obtained by preparing a polypyrrole thin film between Pyrrolyl-CAM and the copper layer.

Pyrrolyl-CAM and the polypyrrole thin film on the substrate were evaluated by an automat-ic contact angle meter and auger electron spectroscopy in order to analyze the condition of the films between the resin substrate and the copper layer.

The peel strength test was carried out in order to evaluate the adhesion force. The best ad-hesion force was 0.98 [N/mm], and the target value of 0.60 [N/mm] was sufficiently achieved.

Keywords

adhesionpolymerCu
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1134: Symposium BB – Polymer-Based Smart Materials–Processes, Properties and Application , 2008 , 1134-BB01-09
Copyright
Copyright © Materials Research Society 2009

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