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Adhesive Failure of a Thin Epoxy Film on an Aluminized Substrate
Published online by Cambridge University Press: 17 March 2011
Abstract
In this study we used nanoindentation to determine mechanical properties and combined nanoindentation with stressed overlayers to determine interfacial fracture energy of a 164 nm thick film of Epon 828/T403 on an aluminized glass substrate. The combination of nanoindentation and a tungsten overlayer was required to trigger delamination of the epoxy film from the aluminized substrate. Mechanics-based models for circular blister formation were then used to determine residual stresses and interfacial fracture energies. This approach showed that the tungsten overlayer had a compressive residual stress of 1.9 GPa which drove blister formation at a fracture energy of 1.9 J/m2 with a phase angle of loading equal to –62°.
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- Copyright © Materials Research Society 2001