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Transmission Electron Microscopy Study of Nonpolar a-Plane GaN Grown by Pendeo-Epitaxy on (1120) 4H-SiC.

Published online by Cambridge University Press:  01 February 2011

D.N. Zakharov
Affiliation:
Lawrence Berkeley National Laboratory, MS 62-203, Berkeley, CA 94720
Z. Liliental-Weber
Affiliation:
Lawrence Berkeley National Laboratory, MS 62-203, Berkeley, CA 94720
B. Wagner
Affiliation:
North Carolina State University, Raleigh, NC 27695
Z.J. Reitmeier
Affiliation:
North Carolina State University, Raleigh, NC 27695
E.A. Preble
Affiliation:
North Carolina State University, Raleigh, NC 27695
R.F. Davis
Affiliation:
North Carolina State University, Raleigh, NC 27695
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Abstract

Pendeo-epitaxy has been applied to nonpolar a-plane GaN layers in order to observe if such process will lead to defect reduction in comparison with direct growth on this plane. Uncoalesced and coalesced a-plane GaN layers with thicknesses 2μm and 12μm, respectively, have been studied by conventional and high resolution electron microscopy. The following structural defects have been observed in pendeo-epitaxial layers: (1) basal stacking faults, (2) threading dislocations, and (3) prismatic stacking faults. A drastic decrease in the density of threading dislocations and stacking faults was observed in ‘wing’ areas with respect to ‘seed’ areas. Cross-section images reveal cracks and voids at the areas where two coalesced wings meet each other. High resolution electron microscopy shows that the majority of stacking faults are low-energy planar defects of the types I1, I2 and I3. The I3 type basal stacking fault, predicted theoretically, was observed experimentally for the first time.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

1 Waltereit, P., Brandt, O., Trampert, A., Grahn, H. T., Menniger, J., Ramsteiner, M., Reiche, M., and Ploog, K. H., Nature 406, 865 (2000)Google Scholar
2 Craven, M. D., Waltereit, P., Feng, W., Speck, J. S., and DenBaars, S. P., Jap. J. Appl. Phys. Lett. 42, L235 (2003)Google Scholar
3 Bernardini, F. and Fiorentini, V.: Phys. Rev. B 57, 9427 (1998)Google Scholar
4 Liu, T.Y., Trampert, A., Sun, Y.J., Brandt, O., Ploog, K.H., Phil. Mag. Lett. 84, 435 (2004)Google Scholar
5 Craven, M.D., Lim, S.H., Wu, F., Speck, J.S. and DenBaars, S.P., Appl. Phys. Lett. 81, 469 (2002)Google Scholar
6 Zakharov, D.N., Liliental-Weber, Z., Wagner, B., Reitmeier, Z.J., Preble, E.A., and Davis, R.F., Mat. Res. Symp. Proc. 798, 747 (2004)Google Scholar
7 Gibart, P., Rep. Prog. Phys. 67, 667 (2004)Google Scholar
8 Hull, D. and Bacon, D.J., Introduction to Dislocation, 3rd Ed., Intl. Series on Materials Science and Technology, (Oxford, New York, Beijing, Frankfurt, Sao Paulo, Sydney, Tokyo, Toronto: Pergamon Press, 1984), p.112 Google Scholar
9 Stampfl, C. and Walle, C.G. Van de, Phys. Rev. B 57, R15052 (1998)Google Scholar
10 Drum, C.M., Phil. Mag. 11, 313 (1965)Google Scholar