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Reliability of Thermal Conductivity Measured by Harman Method

Published online by Cambridge University Press:  10 February 2011

Y. Shinohara
Affiliation:
The 4th Research Group, National Research Institute for Metals, 1–2–1, Sengen, Tsukuba-shi 305–0047, Japan
Y. Imai
Affiliation:
The 4th Research Group, National Research Institute for Metals, 1–2–1, Sengen, Tsukuba-shi 305–0047, Japan
Y. Isoda
Affiliation:
The 4th Research Group, National Research Institute for Metals, 1–2–1, Sengen, Tsukuba-shi 305–0047, Japan
I. A. Nishida
Affiliation:
The 4th Research Group, National Research Institute for Metals, 1–2–1, Sengen, Tsukuba-shi 305–0047, Japan
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Abstract

The Harman method was applied to measure thermal conductivity κ of thermoelectric materials, and the reliability of the measured κ was investigated. The quantitative κ requires a highly sensitive technique to measure minute Peltier heat. Temperature difference by Peltier heat pumping was successfully measured by developing the DC method of resistance measurement. κ of n-type Bi2Te3 sintered compact and n-type PbTe boules was measured at 295K by the Harman method. Static comparative method was also applied to obtain the standard value of κ. In the case of Bi2Te3, the κ by the Harman method agreed well with the standard value. In the case of PbTe in the electron concentration ne range <5 × 1024/m3, the κ almost agreed with the standard value. However, PbTe in the ne range ≥1 × 1025/m3 showed a larger κ than the standard value. The Harman method has an error to give the larger κ for the material with a large carrier component κ, of κ This error is due to the fast conduction of Peltier heat by the carrier. The reliable κ can be measured for the material with a small κ,.

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Articles
Copyright
Copyright © Materials Research Society 1999

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