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Properties and Fracture Resistance of Thin Polycrystalline Aluminum Films on Sapphire Substrates

Published online by Cambridge University Press:  15 February 2011

N. R. Moody ,
D. Medlin ,
S. Guthrie ,
R. Q. Hwang  and
K. F. McCarty
N. R. Moody
Affiliation:
Sandia National Laboratories, Livermore, CA 94551-0969.
D. Medlin
Affiliation:
Sandia National Laboratories, Livermore, CA 94551-0969.
S. Guthrie
Affiliation:
Sandia National Laboratories, Livermore, CA 94551-0969.
R. Q. Hwang
Affiliation:
Sandia National Laboratories, Livermore, CA 94551-0969.
K. F. McCarty
Affiliation:
Sandia National Laboratories, Livermore, CA 94551-0969.
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Abstract

We employed nanoindentation, continuous microscratch testing, and high resolution TEM to determine the effect of structure on the properties and resistance to fracture of thin polycrystalline aluminum films deposited onto single crystal sapphire substrates at 25°C and 250°C. These films had a nominal thickness of 90 nm and a grain size of 160 nm. The elastic and plastic properties were similar for both films. The elastic moduli superimposed, increasing from bulk aluminum values at the surface to sapphire values at the interface. Hardness values also superimposed, but were constant through the film thickness at a value between aluminum and sapphire. In contrast, susceptibility to fracture varied markedly between the films with the 25°C film exhibiting abrupt failure along the film-substrate interface while the 250'C film gave no indication of fracture in the film, along the interface, or in the substrate under the conditions tested.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 403: Symposium I – Polycrystalline Thin Films: Structure, Texture, Properties and Applications II , 1995 , 145
Copyright
Copyright © Materials Research Society 1996

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