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Predictive Design of Multicomponent Polymers for Printed Circuit Boards

Published online by Cambridge University Press:  25 February 2011

A. J. Beuhler ,
J. A. Wrezel ,
J. L. Maas  and
R. C. Sundahl Jr.
A. J. Beuhler
Affiliation:
Allied-Signal Engineered Materials Research Center Des Plaines, Illinois 60017
J. A. Wrezel
Affiliation:
Allied-Signal Engineered Materials Research Center Des Plaines, Illinois 60017
J. L. Maas
Affiliation:
Allied-Signal Engineered Materials Research Center Des Plaines, Illinois 60017
R. C. Sundahl Jr.
Affiliation:
Allied-Signal Engineered Materials Research Center Des Plaines, Illinois 60017
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Abstract

The most common structural and dielectric materials for printed wiring boards are polymer composites such as epoxy/fiberglass and polyimide/fiberglass. The light weight, low cost, processability, and low dielectric constant of these materials make them particularly suited for this application.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 223
Copyright
Copyright © Materials Research Society 1986

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