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Phase Stability and Mechanical Behavior of Ternary Bismuth-Lead-Tin Solders

Published online by Cambridge University Press:  21 February 2011

W. J. Whealon ,
D. S. Stone  and
Y. A. Chang
W. J. Whealon
Affiliation:
Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706
D. S. Stone
Affiliation:
Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706
Y. A. Chang
Affiliation:
Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706
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Abstract

Results from a phase stability study of the Bi-Pb-Sn ternary system and mechanical property data from the testing of the Bi-Pb-Sn ternary eutectic alloy are reported. It is found that the mechanical properties of the ternary eutectic alloy change considerably during cooling due to a solid state phase change at 79° C. After solidification, but prior to this phase transformation, the alloy exhibits brittle failure upon tensile loading. After the phase change high ductility is observed, bordering on superplasticity at low strain rates. Furthermore, having gone through the phase change once, the alloy remains ductile even after it is held at temperatures above 79° C. These results are interpreted in terms of the microstructures observed in the alloy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 359
Copyright
Copyright © Materials Research Society 1990

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References

1 Whealon, W.J., “Constuction of the Bi-Pb-Sn Ternary Phase Diagram,” masters thesis, Department of Materials Science and Engineering, University of Wisconsin, Madison WI.Google Scholar
2 Marcotte, V. and Dehaven, P.W., “Stabilization of a Metastable Phase of the Bi-Pb System by the Addition of Sn,” IBM Rep. 2–13–108/Area 15, (1984).Google Scholar
3 Manko, Howard H., Solders and Soldering Materials Design, Production, and Analysis for Reliable Bonding, Second Ed. (McGraw-Hill, New York, 1979) p. 112 Google Scholar