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Oxidation Kinetics of Cu-Ni Alloy Observed by in situ UHV-TEM

Published online by Cambridge University Press:  01 February 2011

Li Sun ,
John E. Pearson  and
Judith C. Yang
Li Sun
Affiliation:
[email protected], University of Pittsburgh, Mechanical Engineering and Materials Science, 848 Benedum Hall, 3700 O'Hara street, Pittsburgh, PA, 15261, United States
John E. Pearson
Affiliation:
[email protected], Argonne National Laboratory, Argonne, IL, 60439, United States
Judith C. Yang
Affiliation:
[email protected], University of Pittsburgh, Pittsburgh, PA, 15261, United States
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Abstract

The nucleation and growth of Cu2O and NiO islands due to oxidation of Cu-24%Ni(001) films were monitored at various temperatures by in situ ultra-high vacuum (UHV) transmission electron microscopy (TEM). In remarkable contrast to our previous observations of Cu and Cu-Au oxidation, irregular-shaped polycrystalline oxide islands were observed to form with respect to the Cu-Ni alloy film, and an unusual second oxide nucleation stage was noted. Similar to Cu oxidation, the cross-sectional area growth rate of the oxide island is linear indicating oxygen surface diffusion is the primary mechanism of oxide growth.

Keywords

alloyoxidationtransmission electron microscopy (TEM)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1026: Symposium C – Quantitative Electron Microscopy for Materials Science , 2007 , 1026-C05-03
Copyright
Copyright © Materials Research Society 2008

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