Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Scorzoni, A.
De Munari, I.
and
Stulens, H.
1994.
Non-Destructive Electrical Techniques as Means for Understanding the Basic Mechanisms of Electromigration.
MRS Proceedings,
Vol. 337,
Issue. ,
Munari, I De
Scorzoni, A
Tamarri, F
and
Fantini, F
1995.
Activation energy in the early stage of electromigration in Al-1% Si/TiN/Ti bamboo lines.
Semiconductor Science and Technology,
Vol. 10,
Issue. 3,
p.
255.
Maroudas, Dimitrios
and
Pantelides, Sokrates T.
1995.
Theory and Computer Simulation of Grain-Boundary and Void Dynamics in Polycrystalline Conductors.
MRS Proceedings,
Vol. 391,
Issue. ,
Maroudas, Dimitrios
Enmark, Matthew N.
Leibig, Cora M.
and
Pantelides, Sokrates T.
1996.
Analysis of damage formation and propagation in metallic thin films under the action of thermal stresses and electric fields.
Journal of Computer-Aided Materials Design,
Vol. 2,
Issue. 3,
p.
231.
Hunt, A. W.
Riege, S. P.
and
Prybyla, J. A.
1997.
Healing processes in submicron Al interconnects after electromigration failure.
Applied Physics Letters,
Vol. 70,
Issue. 19,
p.
2541.
Riege, S.P.
Thompson, C.V.
and
Clement, J.J.
1998.
A hierarchical reliability analysis for circuit design evaluation.
IEEE Transactions on Electron Devices,
Vol. 45,
Issue. 10,
p.
2254.
Mouthaan, Ton J
and
Petrescu, Violeta
1998.
The modeling of resistance changes in the early phase of electromigration.
Microelectronics Reliability,
Vol. 38,
Issue. 1,
p.
99.
Schoenmaker, W.
and
Petrescu, V.
1998.
Simulation of Semiconductor Processes and Devices 1998.
p.
328.
Schoenmaker, Wim
and
Petrescu, Violeta
1999.
Modeling electromigration as a fluid–gas system.
Microelectronics Reliability,
Vol. 39,
Issue. 11,
p.
1667.
Petrescu, V.
and
Schoenmaker, W.
2004.
Predictive Simulation of Semiconductor Processing.
Vol. 72,
Issue. ,
p.
387.
Lin, Minghui
and
Basaran, Cemal
2005.
Electromigration induced stress analysis using fully coupled mechanical–diffusion equations with nonlinear material properties.
Computational Materials Science,
Vol. 34,
Issue. 1,
p.
82.
Basaran, Cemal
and
Lin, Minghui
2008.
Damage mechanics of electromigration induced failure.
Mechanics of Materials,
Vol. 40,
Issue. 1-2,
p.
66.
Valiev, K.A.
Goldstein, R.V.
Zhitnikov, Yu.V.
Makhviladze, T.M.
and
Sarychev, M.E.
2008.
Modeling of failure and lifetime of thin-film metal conductors in integrated circuits.
Physical Mesomechanics,
Vol. 11,
Issue. 3-4,
p.
158.
Valiev, K. A.
Goldstein, R. V.
Zhitnikov, Yu. V.
Makhviladze, T. M.
and
Sarychev, M. E.
2009.
Nano- and micrometer-scale thin-film-interconnection failure theory and simulation and metallization lifetime prediction, Part 1: A general theory of vacancy transport, mechanical-stress generation, and void nucleation under electromigration in relation to multilevel-metallization degeneration and failure.
Russian Microelectronics,
Vol. 38,
Issue. 6,
p.
364.
Li, Shidong
Sellers, Michael S.
Basaran, Cemal
Schultz, Andrew J.
and
Kofke, David A.
2009.
Lattice Strain Due to an Atomic Vacancy.
International Journal of Molecular Sciences,
Vol. 10,
Issue. 6,
p.
2798.
Sellers, Michael S.
Schultz, Andrew J.
Basaran, Cemal
and
Kofke, David A.
2010.
β-Sngrain-boundary structure and self-diffusivity via molecular dynamics simulations.
Physical Review B,
Vol. 81,
Issue. 13,
Sellers, Michael S.
Schultz, Andrew J.
Basaran, Cemal
and
Kofke, David A.
2010.
Atomistic modeling of β-Sn surface energies and adatom diffusivity.
Applied Surface Science,
Vol. 256,
Issue. 13,
p.
4402.
Sellers, Michael S.
Schultz, Andrew J.
Basaran, Cemal
and
Kofke, David A.
2011.
Effect of Cu and Ag solute segregation on βSn grain boundary diffusivity.
Journal of Applied Physics,
Vol. 110,
Issue. 1,
p.
013528.
Basaran, Cemal
Sellers, Michael S.
Schultz, Andrew J.
Kofke, David A.
and
Yongchang Lee
2012.
Solder joint grain boundary structure and diffusivity via molecular dynamics simulations.
p.
514.