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Microstructural Evolution and Stress Relaxation in Sputtered Tungsten Films

Published online by Cambridge University Press:  21 February 2011

F. M. Ross ,
R. R. Kola ,
R. Hull  and
J. C. Bean
F. M. Ross
Affiliation:
Lawrence Berkeley Laboratory, 1 Cyclotron Road, Berkeley, CA 94720;
R. R. Kola
Affiliation:
AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974.
R. Hull
Affiliation:
AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974.
J. C. Bean
Affiliation:
AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974.
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Abstract

We have investigated the relationship between microstructure and stress in very thin sputtered W films. We discuss features of the microstructure, in particular the presence of voids in compressively stressed films, in terms of the evolution of the structure from a metastable β-phase. By developing a novel specimen geometry for the transmission electron microscope (TEM), we present dynamic observations of the β-W→α-W transformation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 318: Symposium Ca – Interface Control of Electrical, Chemical, and Mechanical Properties , 1993 , 697
Copyright
Copyright © Materials Research Society 1994

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References

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