Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-25T17:32:46.998Z Has data issue: false hasContentIssue false

Growth, crystal structure and stability of Ag-Ni/Cu films

Published online by Cambridge University Press:  01 February 2011

I. K. Bdikin
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia Department of Ceramics and Glass Engineering and Center for Research in Ceramic and Composite Materials (CICECO), University of Aveiro, 3810–193, Aveiro, Portugal
G. K. Strukova
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
G.V. Strukov
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
V.V. Kedrov
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
D.V. Matveev
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
S. A. Zver'kov
Affiliation:
Institute of Solid State Physics, Chernogolovka, Moscow distr. 142432, Russia
A. L. Kholkin
Affiliation:
Department of Ceramics and Glass Engineering and Center for Research in Ceramic and Composite Materials (CICECO), University of Aveiro, 3810–193, Aveiro, Portugal
Get access

Abstract

AgxNi1−x (x=0.0–1.0) films were grown on Cu substrates by electrodeposition method. The films were found to be a nanocrystalline mixture of pure silver and nickel. The grain sizes were determined by X-ray diffraction and electron microscopy techniques. The minimal value was 3.3 nm for the alloy with 70 wt% Ni concentration. The stability of the grown films upon heating in air and in vacuum was examined. An increase in the grain size was found to begin at 150 °C.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ansermet, J-Ph., J. Phys.: Condens. Matter 10, 6027 (1998).Google Scholar
2. Zhao, Z. L., Zhao, Y., Niu, Y., Wang, C. L., and Wu, W. T., J. Alloys Comp. 307, 254 (2000).Google Scholar
3. Zhu, H., Yang, S., Ni, G., Yu, D., and Du, Y., Scripta Mater. 44, 2291 (2001).Google Scholar
4. Yamasaki, T., Scripta Mater. 44, 1497 (2001).Google Scholar
5. Lee, W., Lee, J., Bae, J. D., Byun, C. S., and Kim, D. K., Scripta Mater. 44, 97 (2001).Google Scholar
6. Czerwinski, F., Electrochim. Acta 44, 667 (1998).Google Scholar
7. Czerwinski, F., Li, H., Megret, M., and Szpunar, J. A., Scripta Mater. 37, 1967 (1997).Google Scholar
8. Aus, M., Erb, U., Szpunar, J. A., Cheung, C., Szpunar, B., and Palumbo, G., J. Magn. Magn. Mater. 187, 325 (1998).Google Scholar
9. Burnat, G. K., Fedot'ev, N. P., Vyacheslavov, P. M., and Smiridonova, K. M., Russ. J. Appl. Chem. 41, 291 (1968).Google Scholar
10. Hansen, M., “Constitution of Binary alloys”, McGraw Hill, New York, 1958.Google Scholar
11. Strukov, G. V., Kedrov, V. V., Strukova, G. K., and Klassen, N. V., Slectroplating & surface reatment 7, 24 (1999).Google Scholar
12. Krysov, V. I., Krysova, S. K., Maksimov, I. S., and Medvedev, Y. V., Physica B: Condens. Matter, 265, 291 (1999).Google Scholar