Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-17T17:14:15.139Z Has data issue: false hasContentIssue false

Effects of Surface Treatments on Optical Properties of GaN

Published online by Cambridge University Press:  01 February 2011

Gakuyo Fujimoto
Affiliation:
[email protected], Tohoku University, Center for Interdisciplinary Research, Aramaki aza Aoba 6-3. Aoba-ku, Sendai, Miyagi, 980-8578, Japan, +81-22-795-4404, +81-22-795-7810
Katsushi Fujii
Affiliation:
[email protected], Tohoku University, Center for Interdisciplinary Research, Aramaki aza Aoba 6-3. Aoba-ku, Sendai, Miyagi, 980-8578, Japan
Tsutomu Minegishi
Affiliation:
[email protected], Tohoku University, Center for Interdisciplinary Research, Aramaki aza Aoba 6-3. Aoba-ku, Sendai, Miyagi, 980-8578, Japan
Hiroki Goto
Affiliation:
[email protected], Tohoku University, Center for Interdisciplinary Research, Aramaki aza Aoba 6-3. Aoba-ku, Sendai, Miyagi, 980-8578, Japan
Takenari Goto
Affiliation:
[email protected], Tohoku University, Center for Interdisciplinary Research, Aramaki aza Aoba 6-3. Aoba-ku, Sendai, Miyagi, 980-8578, Japan
Takafumi Yao
Affiliation:
[email protected], Tohoku University, Center for Interdisciplinary Research, Aramaki aza Aoba 6-3. Aoba-ku, Sendai, Miyagi, 980-8578, Japan
Get access

Abstract

Removing artificial oxide layer is important for fabrication process of semiconductor devices. We employed photoluminescence for optical, reflection high energy electron diffraction, atomic force microscope, and Nomarski microscope for surface analysis. We found that it is more difficult to remove the oxide layer made by O-plasma such as in O-plasma asher than that of native one. Our result reached that HF etching is effective for removal of the artificial oxide layer without changing surface morphology. In addition, (NH4)2Sx treatment after HF etching reduces donor bound exciton drastically which is dominant luminescence near the band edge at low temperature.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. O'Leary, S.K., Foutz, B.E., Shur, M.S. and Eastman, L.F., J. Mater. Sci. Mater. Electron. 17, 87 (2006).Google Scholar
2. Peartona, S.J., Zolper, J.C., Shul, R.J. and Ren, F., J. Appl. Phys. 86, 1 (1999).Google Scholar
3. Youtseya, C., Adesida, I., Romano, L.T. and Bulman, G., Appl. Phys. Lett. 72, 560 (1998).Google Scholar
4. Weyhera, J.L., Lewandowskac, R., Machta, L., Lucznikb, B. and Grzegory, I., Mater. Sci. Semiconductor Processing 9, 175 (2006).Google Scholar
5. Shalish, I., Shapira, Y., Burstein, L. and Salzman, J., J. Appl. Phys. 89, 390 (2001).Google Scholar
6. Huh, C., Kim, S., Kim, H., Lee, I. and Park, S., J. Appl. Phys. 87, 4591 (2000).Google Scholar
7. Lin, Y., Lin, W., Lee, C. and Chien, F., Solid State Commun. 137, 257 (2006).Google Scholar
8. Arabasz, S., Bergignat, E., Hollinger, G. and Szuber, J., Appl. Surface Sci. 252, 7659 (2006).Google Scholar
9. Chabal, Y.J., Higashi, G.S., Raghavachari, K. and Burrows, V. A., J. Vac. Sci. Technol. A 7, 1204 (1989).Google Scholar
10. Hong, S.K., Hanada, T., Chen, Y., Ko, H., Yao, T., Imai, D., Araki, K. and Shinohara, M., Appl. Surface Sci. 190, 491 (2002).Google Scholar
11. Hong, S.K., Hanada, T., Chen, Y., Ko, H., Yao, T., Imai, D., Araki, K. and Shinohara, M., Phys. Rev. B 65, 115331 (2002).Google Scholar
12. Toth, M., Fleischer, K. and Phillips, M.R., Appl. Phys. Lett. 67, 23 (1995).Google Scholar