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Effect of Laminates and Alloy Additions on Electromigration in AI Interconnects
Published online by Cambridge University Press: 21 February 2011
Abstract
The effect of solutes and refractory-metal laminates on the electromigration resistance of Al films is consistent with the effect of those variables on Al grain growth during deposition and/or post-patterning anneal.
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- Copyright © Materials Research Society 1993
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