Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-25T17:28:13.505Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of Laminates and Alloy Additions on Electromigration in AI Interconnects

Published online by Cambridge University Press:  21 February 2011

E. M. Atakov ,
A. Shepela  and
B. Miner
E. M. Atakov
Affiliation:
Digital Equipment Corp., 77 Reed Road, Hudson, MA 01749
A. Shepela
Affiliation:
Digital Equipment Corp., 77 Reed Road, Hudson, MA 01749
B. Miner
Affiliation:
Digital Equipment Corp., 77 Reed Road, Hudson, MA 01749
Get access

Abstract

The effect of solutes and refractory-metal laminates on the electromigration resistance of Al films is consistent with the effect of those variables on Al grain growth during deposition and/or post-patterning anneal.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 401
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kinsbron, E., Appl. Phys. Lett., 36 968 (1980).CrossRefGoogle Scholar
2. Vaidya, S., Fraser, D., and Sinha, A., in Proc. IEEE International Reliability Physics Symposium, (IEEE publishers, Las Vegas, 1980), pp. 165–170.Google Scholar
3. Cho, J. and Thomson, C., Appl. Phys. Lett. 54 2577 (1989).CrossRefGoogle Scholar
4. Walton, D., Frost, H., and Thompson, C., in Materials Reliability Issues in Microelectronics, edited by Lloyd, J.R. et al (Mater. Res. Soc. Proc. 255, Pittsburg, PA, 1991) pp. 219–224.Google Scholar
5. Atakov, E.M., in Proc. VLSI Multilevel Interconnection Con. (IEEE publishers, Santa Clara, CA, 1990), pp. 360–362.Google Scholar
6. Sanchez, J.E. Jr, McKnelly, L.T., and Morris, J.W. Jr, J. Electr. Materials 19 1213 (1990).Google Scholar
7. Atakov, E.M., Clement, J.J., and Miner, B. (this issue).Google Scholar
8. Kowalik, J., Report No CTL 88-1026, 1988; Report No 89-0527, 1989.Google Scholar
9. Massalski, T.B., in Binary Alloys Phase Diagrams, (ASM, 1986).Google Scholar
10. Rodbell, K.P., Knorr, D.B., and Tracy, D.P., in Materials Reliability in Microelectronics II, edited by Thompson, C.V. and Lloyd, J.R. (Mater. Res. Soc. Proc. 265, Pittsburgh, PA, 1992), pp. 105–112.Google Scholar
11. Sinke, W. et al. , Appl. Phys. Lett., 47 471 (1985).CrossRefGoogle Scholar