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The Effect of Deposition Procedure on the Conductivity of Hydrogenated Amorphous Silicon Multilayer Films.

Published online by Cambridge University Press:  28 February 2011

G. Moddel
Affiliation:
Department of Electrical and Computer Engineering, University of Colorado. Boulder, CO 80309-0425
F.-C. Su
Affiliation:
Department of Materials Science and Engineering, State University of New York, Stony Brook, NY 11794
P. E. Vanier
Affiliation:
Metallurgy and Materials Science Division, Brookhaven National Laboratory, Upton, NY 11973.
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Abstract

The conductivity of multilayer P-doped amorphous hydrogenated silicon (a-Si:H) thin films is measured for films prepared with different, deposition procedures. Multilayer films are deposited by plasma enhanced CVD following a procedure in which the plasma is extinguished and the deposition chamber is filled with air or argon after the deposition of each layer. These films are compared to films grown in continuous deposition runs. The technique provides a direct means to determine the effects of continuous versus interrupted deposition and to analyze oxide interface and bulk gap state densities. Exposing the layers to air between depositions produces deleterious effects whereas the effect of argon exposure are slight. Literature values for the density of states in oxidized a-Si:H are used to provide evidence for a defective layer in very thin P-doped a-Si:H having a defect density of over 1013 cm−2 eV−1 approximately 0.3 eV below the transport level.

Type
Articles
Copyright
Copyright © Materials Research Society 1986

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References

REFERENCES

1. Kakalios, J. and Fritzsche, H., Phys. Rev. Lett. 53, 1602 (1984).Google Scholar
2. Su, F.-C., Levine, S., Vanier, P.E. and Kampas, F.J., Appl. Phys. Lett. 47, 612 (1985).Google Scholar
3. Dohler, G.H., in Tetra~hedrally-Bonded Amorphous Semiconductors, edited by Adler, D. and Fritzsche, H. (Plenum Press, New York, 1985), p. 415.Google Scholar
4. Keiemen, S.R., Goldstein, Y. and Abeles, B., Surface Sci. 116, 488 (1982).Google Scholar
5. Vanier, P.E., Delahoy, A.E. and Griffith, R.W., J. Appl. Phys. 52, 5235 (1981).Google Scholar
6. Ast, D.G. and Brodsky, M.H., J. Non-Cryst. Solids 35 & 36, 611 (1980).Google Scholar
7. Goldstein, B. and Szostak, D.J., Surface Sci. 99, 235 (1980).Google Scholar
8.- Aker, B., Peng, Shao-Qi, Cai, Song-yi and Fritzsche, H., J. Non-Cryst. Solids 59 & 60, 509 (1983).Google Scholar
9. Wagner, I., Stasiewski, H., Abeles, B. and Lanford, W.A., Phys. Rev. B 28, 7080 (1983).CrossRefGoogle Scholar
10. Williams, R.H., Varma, R.R., Spear, W.E. and LeComber, P.G., J. Phys. C 12, L209 (1979).Google Scholar
11. Kirby, P.B., MacLeod, D.W. and Paul, W., Phil. Mag. B 51, 389 (1985).Google Scholar
12. Beichler, J., Mell, H. and Weber, K., J. of Non-Cryst. Solids 59 & 60, 257 (1983).Google Scholar
13. Jackson, W. B., Biegelsen, D.K., Nemanich, R.J. and Knights, J.C., Appl. Phys. Lett. 42, 105 (1983).Google Scholar