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Deformable Microsystem for In Situ Cure Degree Monitoring of GFRP (Glass Fiber Reinforced Plastic)

Published online by Cambridge University Press:  11 September 2015

Yang Yang ,
Gabriele Chiesura ,
Thomas Vervust ,
Frederick Bossuyt ,
Geert Luyckx ,
Markus Kaufmann ,
Joris Degrieck  and
Jan Vanfleteren
Yang Yang*
Affiliation:
Center for Microsystems Technology, Ghent, Belgium Ghent University, Ghent, Belgium. IMEC, Leuven, Belgium.
Gabriele Chiesura
Affiliation:
Ghent University, Ghent, Belgium.
Thomas Vervust
Affiliation:
Center for Microsystems Technology, Ghent, Belgium Ghent University, Ghent, Belgium. IMEC, Leuven, Belgium.
Frederick Bossuyt
Affiliation:
Center for Microsystems Technology, Ghent, Belgium Ghent University, Ghent, Belgium. IMEC, Leuven, Belgium.
Geert Luyckx
Affiliation:
Ghent University, Ghent, Belgium.
Markus Kaufmann
Affiliation:
Sirris Leuven-Gent Composites Application Lab, Leuven, Belgium.
Joris Degrieck
Affiliation:
Ghent University, Ghent, Belgium.
Jan Vanfleteren
Affiliation:
Center for Microsystems Technology, Ghent, Belgium Ghent University, Ghent, Belgium. IMEC, Leuven, Belgium.
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Abstract

Fibre Reinforced Polymer (FRP) is becoming a valid alternative to many traditional heavy metal industries because of its high specific stiffness over the more classical construction metals. Recent trend of more complex geometry of composites is causing increasing difficulty in composite manufacturing. A method to optimize the manufacturing process is thus imposed to ensure and improve the quality of manufactured parts. Because of the irregular 3D shapes of the composites, traditional flat sensor system is becoming unfavorable and nonpractical for monitoring purpose. In this work, the current development status of a deformable microsystem for in situ cure degree monitoring of a glass fibre reinforced plastic is presented. To accommodate the non-flat shape of the composites, the proposal is to interconnect non-deformable functional island, which contains the capacitive sensor for cure degree monitoring, with meander-shaped deformable interconnections. The developed sensor system is able to withstand the manufacturing process where change of pressure and internal strain, thus force exerted on the sensor system, is involved.

Keywords

laser ablationlithography (removal)dielectric
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1798: Symposium LL – Soft Electronics―From Electronic Skin to Reliable Neural Interfaces , 2015 , mrss15-2136585
Copyright
Copyright © Materials Research Society 2015 

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References

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