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Cure Technology for Controlled Stress in Thin Benzocyclobutene Coatings

Published online by Cambridge University Press:  15 February 2011

P. H. Townsend ,
D. C. Burdeaux ,
T. M. Stokich  and
M. G. Dibbs
P. H. Townsend
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
D. C. Burdeaux
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
T. M. Stokich
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
M. G. Dibbs
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
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Abstract

The stress at room temperature in many typical polymer coatings used for microelectronic dielectrics is near 40 MPa. Polymer coatings derived from divinylsiloxane bisbenzocyclobutene (BCB), (CAS 117732-87-3), have a stress level of ca. 38 MPa after a conventional thermal oven cure. In this work, a novel approach based on curing the BCB polymeric network in the vitrified state has been used to achieve far field stresses of 24 MPa in the final coatings. This represents a 36% reduction in the far field stress of BCB coatings cured at 250 °C. The cure methodology and compatibility with device process design are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 135
Copyright
Copyright © Materials Research Society 1992

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References

1. Townsend, P. H., Stokich, T. M., and Huber, B. S., Proceedings of the Materials Research Society 226, 215 (1991).CrossRefGoogle Scholar
2. Brantley, W. A., J. Appl. Phys. 44, 534 (1973).CrossRefGoogle Scholar
3. Townsend, P. H., Hahn, S. F., Burdeaux, D. C., Thomsen, M., McGee, R., Gilpin, J. A., Carr, J. N., Johnson, R. W., and Phillips, T. L., Proceedings 3rd International SAMPE Electronics Conference, pp 67–77, Los Angeles, 1989.Google Scholar
4. Townsend, P. H., Burdeaux, D. C., Hahn, S. F., Thomsen, M., and Carr, J. N., Proceedings of the Materials Research Society, Vol.154, pg. 47 (1989).CrossRefGoogle Scholar
5. Bair, H. E. and Pryde, C. A., “Curing and Glass Transition Behavior of a Benzocyclobutene Polymer,” Proc. of the Soc. of Plastics Eng., ANTEC Montreal, 1991.Google Scholar
6. Stokich, T. M. Jr., Proceedings of the Materials Research Society, Symposium on Materials Science of High Temperature Polymers for Microelectronics, Los Angeles (1991).Google Scholar
7. Hahn, S. F. and Martin, S. J., private communications - results to be published.Google Scholar