Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-25T17:44:57.708Z Has data issue: false hasContentIssue false

Anisotropy in Thermal, Electrical and Mechanical Properties of Spin-Coated Polymer Dielectrics

Published online by Cambridge University Press:  22 February 2011

Sue Ann Bidstrup
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
Thomas C. Hodge
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
Linda Lin
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
Paul A. Kohl
Affiliation:
School of Chemical Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0100
J.B. Lee
Affiliation:
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0250
Mark G. Allen
Affiliation:
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, 30332-0250
Get access

Abstract

In MCM-D applications, interlayer dielectrics separate and insulate metal conductors to form a three-dimensional interconnection structure. Due to the three-dimensional nature of these structures, the thermal, electrical and mechanical properties of the dielectricmaterials must be known for all orientations in order to correctly design and simulate devices. The most commonly used polymer in microelectronics, polyimide, exists in formulations which have been shown to have a high degree of orientation and exhibit anisotropicproperties.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Lin, L. and Bidstrup, S.A., “Processing Effects on Optical Anisotropy in Spin-Coated Polyimide Films”, Journal of Applied Polymer Science, 49, 12771289 (1993).Google Scholar
2. Herminghaus, S., Boese, D., Yoon, D.Y., and Smith, B.A., “Large anisotropy in optical properties of thin polyimide films of poly(p-phenylene biphenyltetracarboximide)”, Applied Physics Letters, 59(9), 10431045 (1991)Google Scholar
3. Boese, D., Herminghaus, S., Yoon, D.Y., Swalen, J.D., and Rabolt, J.F., “Stiff Polyimides: Chain Orientation and Anisotropy of the Optical and Dielectric Properties of Thin Films”, MRS Symposium Proceedings Vol. 227, 379386 (1991).Google Scholar
4. Chen, S.T. and Wagner, H.H., “Out-of-Plane Thermal Expansion Coefficient of Biphenyldianhydride-Phenylenediamine Polyimide Film”, Journal of Electronic Materials, 22(7), 797799 (1993).Google Scholar
5. Russell, T.P., Gugger, H., and Swalen, J.D., “In-Plane Orientation of Polyimide”, Journal of Polymer Science: Polymer Physics Edition, 21, 17451756 (1983).Google Scholar
6. Takahashi, N., Yoon, D.Y., and Parrish, W., “Molecular Order in Condensed States of Semiflexible Poly(amic acid) and Polyimide”, Macromolecules, 17, 25832588 (1984).Google Scholar
7. Elsner, G., Kempf, J., Bartha, J.W., and Wagner, H.H., “Anisotropy of Thermal Expansion of Thin Polyimide Films”, Thin Solid Films, 185(1), 189197 (1990).Google Scholar
8. Tong, H.M., Hsuen, H.K.D., Saenger, K.L., and Su, G.W., “Thickness-direction coefficient of thermal expansion measurement of thin polymer films”, Rev. Sci. Instrum., 62(2), 422430 (1991).Google Scholar
9. Tong, H.M., Saenger, K.L., and Su, G.W., “Thickness Direction Measurements of Polymer Thin Film Thermal Expansion Coefficients”, ANTEC Proceedings 1991, 17271730 (1991).Google Scholar
10. Pottiger, M.J. and Coburn, J.C., “Out-of-Plane Expansion Measurements in Polyimide Films”, Polymers for Microelectronics; ACS Symposium Series (1992).Google Scholar
11.Benzocyclobutene Polymer Data Sheets. Midland, Michigan: Dow Chemical Company, Microelectronic Polymers Division.Google Scholar
12. Cassidy, P.E. and Fawcett, N.C., “Polyimides”, Kirk-Othmer Encyclopedia of Chemical Technology, Grayson, M. and Eckroth, D., eds., New York: John Wiley and Sons, 18, 704719 (1982).Google Scholar
13. Lee, H.L., Optimization of a Resin Cure Sensor, M.S. Thesis, Massachusetts Institute of Technology, Cambridge, MA (1982).Google Scholar
14.ASTM D150-92, “Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials” (1992).Google Scholar
15. Garrou, P.E., Heistand, R.H., Manial, T.A., Mohler, C.E., Stokich, T.M., Townsend, P.H., Adema, G.M., Berry, M.J., and Turlik, I., “Rapid Thermal Curing of BCB Dielectric”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 4652 (1993).Google Scholar
16. Ku, C.C. and Liepins, R., Electrical Properties of Polymers: Chemical Principles, Hanser Publishers, New York, 5455 (1987).Google Scholar
17. Senturia, S.D., and Sheppard, N.F. Jr, “Dielectric Analysis of Thermoset Cure”, Advances in Polymer Science, Springer-Verlag Berlin Heidelberg (1986).Google Scholar
18. Wortman, J.J. and Evans, R.A., Journal of Applied Physics, 36, 153 (1965).Google Scholar
19. Hummel, R.E., Electronic Properties of Materials, Spring-Verlag, New York, 140 (1985).Google Scholar
20. Adams, A.C., Schinke, D.P., and Capio, C.D., Journal of the Electrochemical Society: Solid State Science and Technology, 126, 15391543 (1979).Google Scholar
21. Ostergaard, D.F., Electromagnetics, a Revision 5.0 Tutorial, Swanson Analysis Systems, Inc., Houston, PA, p. 3.1 (1992)Google Scholar