With the new "L" brackets that are available for the Tripod Polisher™ (South Bay Technology, Inc.) which allow the sample to be easily backlit with room lights, it is relatively easy to grind away most of the material to be removed when polishing the second side of a sample. The following steps outline the procedure that I have been using for rapidly removing material and getting the samples very thin prior to starting the final wedge polishing. The samples that I have been preparing with this technique are approximately 1µm thick, pulsed laser deposited ZnO-WS2 films on SiC substrates.