Hostname: page-component-cd9895bd7-jkksz Total loading time: 0 Render date: 2024-12-24T00:00:01.607Z Has data issue: false hasContentIssue false
  • English
  • Français

A TEM Investigation of the Network Structure of Electron Beam Cured Epoxy Polymers

Published online by Cambridge University Press:  14 March 2018

Richard L. Schalek ,
Brigitte Defoort  and
Lawrence T. Drzal
Richard L. Schalek
Affiliation:
Composite Materials and Structures Center
Brigitte Defoort
Affiliation:
Composite Materials and Structures Center
Lawrence T. Drzal
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University

Extract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

Glassy network epoxies have widespread applications as matrices for advanced composites As an alternative to thermal curing, electron beam (ebeam) processing has been demonstrated as a very powerful tool for achieving fast and efficient curing [1,2]. E-beam curing of epoxy based resins using suitable onium salts as initiators proceeds via a cationic mechanism. The final polymer network properties are highly dependent on processing conditions and curing kinetics. It was demonstrated that under certain processing conditions, heterogeneities can appear in the material, due to the agglomeration of initiator residue. Initially the initiator is miscible with the resin; however, reaction-induced phase separation occurs as the increasing molecular weight of the polymer reduces the solubility of the initiator.

Type
Research Article
Information
Microscopy Today , Volume 10 , Issue 5 , September 2002 , pp. 24 - 25
Copyright
Copyright © Microscopy Society of America 2002

References

References:

1.) Defoort, B., Drzal, L.T., SAMPE 46th International Symposium, Long Beach, CA. pp 2550–2562, (2001).Google Scholar
2.) Glauser, T., Johansson, M., and Hult, A., “Electron-beam Curing of Thick Thermoset Composite Matrices”, Polymer, 40, 5297–5302.Google Scholar